2004
DOI: 10.1016/j.sse.2003.12.039
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Requirements for ultra-thin-film devices and new materials for the CMOS roadmap

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Cited by 59 publications
(16 citation statements)
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“…Here, one can easily create the NDT feature by changing the magnitude of |V G | because the gate driving force is very strong in the UTB-based MOS stack ( i.e ., explicit control of the accumulation-depletion-inversion modes by |V G | in the UTB-channel MOSFETs) 44 , 45 . For example, when applying a negative gate voltage ( i.e ., V G2 < 0), I D will start to increase because −|V G2 | reduces the electron concentration at the channel and eventually gives rise to the increase in diffusion/drift currents through the source-channel-drain (Fig.…”
Section: Resultsmentioning
confidence: 99%
“…Here, one can easily create the NDT feature by changing the magnitude of |V G | because the gate driving force is very strong in the UTB-based MOS stack ( i.e ., explicit control of the accumulation-depletion-inversion modes by |V G | in the UTB-channel MOSFETs) 44 , 45 . For example, when applying a negative gate voltage ( i.e ., V G2 < 0), I D will start to increase because −|V G2 | reduces the electron concentration at the channel and eventually gives rise to the increase in diffusion/drift currents through the source-channel-drain (Fig.…”
Section: Resultsmentioning
confidence: 99%
“…The device is remarkably symmetric, compared to previously published work [5], possibly due to compensation of the unintentional doping of the Ge layer. The 'oN/AI'oFF ratio is about 100, which is comparable to [5] and other ultra-thin SOI transistors [6].…”
Section: Standard Transistor Characteristicssupporting
confidence: 50%
“…The I on / I off ratio is not as large as the best device in Fig. 1, but still comparable to ultrathin SOI transistors 8,9 and bulk Ge FETs. 1 Significantly, this device is clearly ambipolar, with P-channel and N-channel operations available in the same structure as a function of V GS .…”
mentioning
confidence: 65%