Research on processing technology of beam membrane structure based on porous silicon

Abstract

Aiming at the problem of poor reliability of beam membrane fabrication in silicon microstructure processing technology, a technique for preparing microbeams using porous silicon sacrificial layer is proposed. The comparison of different porosity, different depths of porous silicon to beam membrane release and the comparison of different beam structures to beam membrane release were studied. The experiment was carried out by selecting different process parameters and testing the prepared beam membrane. According to the test results, the appropriate electrochemical corrosion process parameters were selected to prepare the porous silicon layer with appropriate porosity, large depth, good support effect and fast release speed, which can realize the release of the beam membrane and improve the reliability of the beam membrane. The field of application of microsensors and microactuators has been greatly increased.

Research on Processing Technology of Multi-Layer Heterogeneous Material Composite Micron Cantilever Beam Structure

“…Porous silicon is prepared in a specific area by electrochemical etching technology [20][21][22]. The porous silicon sacrificial layer with good performance could be prepared by controlling the current density and solution concentration [23,24]. Static balance in cross section:…”