Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation

Zhang, Zhongqing; Fu, Guicui; Wan, Bo; Su, Yuezeng; Jiang, Maogong

doi:10.1016/j.microrel.2021.114203

Cited by 11 publications

(5 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Silver (Ag) nanoparticles have attracted extensive interest due to their excellent conductivity, tunable optical properties, and sintering properties. − In general, those physical and chemical properties were affected dramatically by the size and shape of nanoparticles. Thus, the synthesis of silver nanoparticles with a specific shape is of great importance.…”

Section: Introductionmentioning

confidence: 99%

Solvothermal Preparation of Crystal Seeds and Anisotropy-Controlled Growth of Silver Nanoplates

Zhang,

Xue,

Qin

et al. 2024

ACS Omega

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 99%

Solvothermal Preparation of Crystal Seeds and Anisotropy-Controlled Growth of Silver Nanoplates

Zhang,

Xue,

Qin

et al. 2024

ACS Omega

View full text Add to dashboard Cite

“…Due to the disappearance of pores or grain boundaries during the sintering process, significant changes occur in the microstructural topology, adding to the complexity of the problem and imposing limitations on such models [11][12][13]. On the other hand, simulation methods that do not require direct interface tracking include molecular dynamics simulations [14,15], Monte Carlo simulations [16][17][18][19], cellular automata [20,21], and phasefield methods [22][23][24]. These methods have found increasingly widespread application in simulating the sintering process, offering advantages in terms of not requiring direct interface tracking.…”

Section: Introductionmentioning

confidence: 99%

Phase-Field Simulation of Sintering Process: A Review

Xue,

2024

CMES

View full text Add to dashboard Cite

Sintering, a well-established technique in powder metallurgy, plays a critical role in the processing of high melting point materials. A comprehensive understanding of structural changes during the sintering process is essential for effective product assessment. The phase-field method stands out for its unique ability to simulate these structural transformations. Despite its widespread application, there is a notable absence of literature reviews focused on its usage in sintering simulations. Therefore, this paper addresses this gap by reviewing the latest advancements in phase-field sintering models, covering approaches based on energy, grand potential, and entropy increase. The characteristics of various models are extensively discussed, with a specific emphasis on energy-based models incorporating considerations such as interface energy anisotropy, tensor-form diffusion mechanisms, and various forms of rigid particle motion during sintering. Furthermore, the paper offers a concise summary of phase-field sintering models that integrate with other physical fields, including stress/strain fields, viscous flow, temperature field, and external electric fields. In conclusion, the paper provides a succinct overview of the entire content and delineates potential avenues for future research.

show abstract

“…Thorough stirring is required before use if the paste brazing material shows signs of stratification. The performance of the brazing material significantly influence the quality of the brazed joint [10][11][12][13] . In this study, Al-Si-Cu-Ni low melting point brazing materials were prepared into material powders with suitable particle size using nitrogen atomization technology.…”

mentioning

confidence: 99%

Study on microstructure and mechanical properties of 3003 aluminum alloy joints brazed with Al–Si–Cu–Ni paste brazing materials

Gao,

Jin,

et al. 2024

Sci Rep

View full text Add to dashboard Cite

Paste-type brazing materials have advantages such as adjusting the complexity of the parts to be soldered, easy storage and production in certain quantities. They can be used for brazing heat exchangers, liquid tanks and corrosion resistant parts. In this work, the microstructures and thermal behaviors of Al–Si–Cu–Ni brazing materials with different contents were investigated, and the effect of brazing process on the microstructural evolution and mechanical properties of brazed joints produced under nitrogen-filled environment was examined. It was found that the melting temperature of brazing material Al–5Si–20.5Cu–2Ni were ranged from 512.86 to 549.37 °C. The microstructure of Al–5Si–20.5Cu–2Ni consisted of α-Al solid solution, CuAl2 intermetallic compounds, the Al–Si–Cu phase, and some fine irregular Si particles in a homogenous manner. The microstructure of the brazed joints was uniformly formed during the brazing condition of 580 °C for 20 min, and the shear strength of the joints reached 41.76 MPa.

show abstract

Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation

Cited by 11 publications

References 16 publications

Solvothermal Preparation of Crystal Seeds and Anisotropy-Controlled Growth of Silver Nanoplates

Solvothermal Preparation of Crystal Seeds and Anisotropy-Controlled Growth of Silver Nanoplates

Phase-Field Simulation of Sintering Process: A Review

Study on microstructure and mechanical properties of 3003 aluminum alloy joints brazed with Al–Si–Cu–Ni paste brazing materials

Contact Info

Product

Resources

About