Residual stress in ion-assisted coatings

High rate deposition of thick CrN and Cr2N coatings using modulated pulse power (MPP) magnetron sputtering

“…In another aspect, as the coating grows thicker, the longer deposition time and gradually increased substrate temperature allow the buried defects (e.g. the Schottky defects and Frenkel disorder) to have more time to diffuse through the crystal structure and arrive at dislocation cores or grain boundaries where they become absorbed [42]. The absorption or annihilation of the defects releases the stress [43].…”

Influence of substrate bias voltage on the microstructure and residual stress of CrN films deposited by medium frequency magnetron sputtering

“…The lattice parameter increases as the bias voltages ranging from −100 V to −400 V are applied to the substrate. This may be attributed to the enhanced flux and energy of the bombarding ions, whereby Frenkel pairs and anti-Schottky defects are induced by the "ion peening effect" [25,26]. However, the lattice parameter shows a slight decrease when the substrate bias voltage is increased to −500 V, which appears to be related to the deficiency in N atoms relative to the stoichiometric CrN [27].…”

SiNx coatings deposited by reactive high power impulse magnetron sputtering: Process parameters influencing the residual coating stress

“…3(a)) and the additional gain in particle energy due to the increased negative substrate bias does not appear to contribute substantially to the compressive stresses. Here, the onset of the momentum transfer regime, where the compressive stress saturates, [58][59][60] is most likely observed. Although comparatively high compressive stress values are extracted for coatings deposited using increasing pulse energies or bias voltages, nanoindentation tests showed only a weak and insignificant trend towards higher coating hardnesses and elastic moduli.…”