Resistive switching of silicon-silver thin film devices in flexible substrates

Dias, Catarina; Leitao, Diana C.; Freire, Carmen S.R.; Gomes, Henrique L.; Cardoso, S.; Ventura, J.

doi:10.1088/1361-6528/ab5eb7

Cited by 6 publications

(1 citation statement)

References 51 publications

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“…A body expands or contracts every time it undergoes temperature changes without any phase transformation. This is of particular importance in microfabrication, since the different materials can be grown at distinct temperatures, T dep , or several patterning steps or annealing treatments may require or impose changes in temperature [38,39]. After these steps at high temperature, the materials are brought back to the room temperature, T room .…”

Section: Thermoelastic Strainmentioning

confidence: 99%

Derivation of analytical expressions for the stress/strain distributions, bending plane and curvature radius in multilayer thin-film composites

Mouro¹,

Ferreira²,

Silva³

et al. 2021

J. Micromech. Microeng.

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Recent paradigms, such as smart cities/homes, Internet of Things or portable and implantable healthcare systems, require the use of flexible and conformal sensors that can be assembled to arbitrarily 3D complex shapes. A good set of simple and available models is of paramount importance to help designing and fabricating such devices. In this work, analytical expressions for the bending plane, the curvature radii and the stress/strain distributions of multilayer composite devices are derived for the cases of uniaxial and biaxial plane stress and plane strain and generalised plane strain. The analytical results are summarized, and two case-studies are analysed and compared with the help of these models: bilayer and trilayer hinges for self-assembled structures and rolled up flexible substrates with sensors on top. The dependence of the curvature radii and strain and stress distributions on several mechanical properties of the composite is assessed. The applicability of these models to support the design of flexible sensors, electronics or haptic devices is discussed and their practical limitations analysed.

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Section: Thermoelastic Strainmentioning

confidence: 99%

Derivation of analytical expressions for the stress/strain distributions, bending plane and curvature radius in multilayer thin-film composites

Mouro¹,

Ferreira²,

Silva³

et al. 2021

J. Micromech. Microeng.

View full text Add to dashboard Cite

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Recent advancements in metal oxide‐based hybrid nanocomposite resistive random‐access memories for artificial intelligence

Kumar,

Bhardwaj,

Singh

et al. 2024

InfoMat

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Artificial intelligence (AI) advancements are driving the need for highly parallel and energy‐efficient computing analogous to the human brain and visual system. Inspired by the human brain, resistive random‐access memories (ReRAMs) have recently emerged as an essential component of the intelligent circuitry architecture for developing high‐performance neuromorphic computing systems. This occurs due to their fast switching with ultralow power consumption, high ON/OFF ratio, excellent data retention, good endurance, and even great possibilities for altering resistance analogous to their biological counterparts for neuromorphic computing applications. Additionally, with the advantages of photoelectric dual modulation of resistive switching, ReRAMs allow optically inspired artificial neural networks and reconfigurable logic operations, promoting innovative in‐memory computing technology for neuromorphic computing and image recognition tasks. Optoelectronic neuromorphic computing architectured ReRAMs can simulate neural functionalities, such as light‐triggered long‐term/short‐term plasticity. They can be used in intelligent robotics and bionic neurological optoelectronic systems. Metal oxide (MOx)–polymer hybrid nanocomposites can be beneficial as an active layer of the bistable metal–insulator–metal ReRAM devices, which hold promise for developing high‐performance memory technology. This review explores the state of the art for developing memory storage, advancement in materials, and switching mechanisms for selecting the appropriate materials as active layers of ReRAMs to boost the ON/OFF ratio, flexibility, and memory density while lowering programming voltage. Furthermore, material design cum‐synthesis strategies that greatly influence the overall performance of MOx–polymer hybrid nanocomposite ReRAMs and their performances are highlighted. Additionally, the recent progress of multifunctional optoelectronic MOx–polymer hybrid composites‐based ReRAMs are explored as artificial synapses for neural networks to emulate neuromorphic visualization and memorize information. Finally, the challenges, limitations, and future outlooks of the fabrication of MOx–polymer hybrid composite ReRAMs over the conventional von Neumann computing systems are discussed.image

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A flexible aluminum thin film electrode with enhanced electrical property and stability via a facial method

Wang

Cao

Miao

2021

J Mater Sci: Mater Electron

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Resistive switching of silicon-silver thin film devices in flexible substrates

Cited by 6 publications

References 51 publications

Derivation of analytical expressions for the stress/strain distributions, bending plane and curvature radius in multilayer thin-film composites

Derivation of analytical expressions for the stress/strain distributions, bending plane and curvature radius in multilayer thin-film composites

Recent advancements in metal oxide‐based hybrid nanocomposite resistive random‐access memories for artificial intelligence

A flexible aluminum thin film electrode with enhanced electrical property and stability via a facial method

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