The bipolar resistance switching characteristics were confirmed in a resistive memory device with an Ag/Bi 1.10 (Fe 0.95 Mn 0.05 )O 3 /SRO/Pt/TiO 2 /SiO 2 /Si(100) structure, in which the limiting current was 1 mA. In comparison with BiFeO 3 -based memory, it was found that doping with Mn effectively reduced the leakage current of the device and thus improved the device endurance (200 cycles-1000 cycles). The high-temperature retention test demonstrated that the device could be used for 10 years without losing data. Through x-ray photoelectron spectroscopy analysis of Bi 1.10 (Fe 0.95 Mn 0.05 )O 3 thin film elements, it was inferred that both the oxygen vacancies, which are produced by high-temperature conditional growth, and the doped Mn change the Fe valence, thereby reducing the leakage current. Finally, through fitting analysis of the I-V diagram and temperature tests in the low-resistance state, we inferred that the behavior of the resistance conversion is due to the formation of Ag conductive filaments.