Resistless patterning of sub-micron structures by evaporation through nanostencils

Brugger, Jürgen; Berenschot, J.W.; Kuiper, S.; Nijdam, W.; Otter, Benjamin; Elwenspoek, M.

doi:10.1016/s0167-9317(00)00343-9

Cited by 147 publications

(102 citation statements)

References 7 publications

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“…Compared to the previous techniques, SL has a lower resolution and the patterning area is limited by the size and stability of the membranes; nevertheless, SL has been used to pattern metallic dots <50 nm in diameter with chip size stencils 16,19 and areas up to 1 × 3 mm 2 have been patterned with 300 nm metallic dots. 20 Since SL does not require any resist processing, it has the advantage of reducing the number of steps required for patterning and allowing the patterning of a broad range of substrates compared to resistbased techniques. For instance, SL has been used to deposit metals, 20 fullerenes, 21 organic conductive molecules, 22 complex oxides 23 and magnetic alloys 24 and to pattern different substrates such as self-assembled monolayers (SAMs), 25 organic layers, 26 polymer substrates, 27 CMOS devices, 28 cantilevers, and nonplanar substrates.…”

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confidence: 99%

“…For instance, SL has been used to deposit metals, 20 fullerenes, 21 organic conductive molecules, 22 complex oxides 23 and magnetic alloys 24 and to pattern different substrates such as self-assembled monolayers (SAMs), 25 organic layers, 26 polymer substrates, 27 CMOS devices, 28 cantilevers, and nonplanar substrates. 20 Another important advantage of SL is that the stencils can be reused many times. 19,26,29,30 In particular stencils containing nanoapertures have been used up to 12 times for Al depositions without showing any degradation or damage on the membranes.…”

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confidence: 99%

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Metallic Nanowires by Full Wafer Stencil Lithography

et al. 2008

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Aluminum and gold nanowires were fabricated using 100 mm stencil wafers containing nanoslits fabricated with a focused ion beam. The stencils were aligned and the nanowires deposited on a substrate with predefined electrical pads. The morphology and resistivity of the wires were studied. Nanowires down to 70 nm wide and 5 µm long have been achieved showing a resistivity of 10 µΩcm for Al and 5 µΩcm for Au and maximum current density of ∼10 8 A/cm 2 . This proves the capability of stencil lithography for the fabrication of metallic nanowires on a full wafer scale.An important objective in nanotechnology is the development of alternative nanopatterning methods and the fabrication of novel nanoscale structures and materials. Among such structures, nanowires (NWs) have shown potential and applications in a broad range of fields such as electronics, 1,2 magnetic memories, 3 thermoelectric, 4,5 nanomechanical, 6 optoelectronic, 7 and biosensing devices 8-10 due to their physical properties and surface to volume ratio. In particular, metallic nanowires can be applied for interconnects, magnetic memories based on spin-polarized current 3 and biosensors. 9 To fabricate NWs, the two approaches used are the chemical synthesis (bottom-up) and the nanopatterning methods (topdown).

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Metallic Nanowires by Full Wafer Stencil Lithography

et al. 2008

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“…To accurately characterize the in-plane strain of the actuated devices, an array of 100 nm thick 4 μm diameter aluminum dots is deposited through a stencil mask on each actuator ( figure 8). The holes in the stencil are etched in a 500 nm thick silicon nitride membrane that enables depositing micrometer features using a thermal evaporator [43,44]. The stencil mask is carefully aligned with the device to have an array of dots on each actuator, as seen in figure 8(a).…”

Section: Static Responsementioning

confidence: 99%

Microfabrication and characterization of an array of dielectric elastomer actuators generating uniaxial strain to stretch individual cells

Akbari¹,

Shea²

2012

J. Micromech. Microeng.

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Cells regulate their behavior in response to mechanical strains. Cell cultures to study mechanotransuction are typically cm 2 in area, far too large to monitor single cell response. We have developed an array of dielectric elastomer microactuators as a tool to study mechanotransduction of individual cells. The array consists of 72 100 μm × 200 μm electroactive polymer actuators which expand uniaxially when a voltage is applied. Single cells will be attached on each actuator to study their response to periodic mechanical strains. The device is fabricated by patterning compliant microelectrodes on both sides of a 30 μm thick polydimethylsiloxane membrane, which is bonded to a Pyrex chip with 200 μm wide trenches. Low-energy metal ion implantation is used to make stretchable electrodes and we demonstrate here the successful miniaturization of such ion-implanted electrodes. The top electrode covers the full membrane area, while the bottom electrodes are 100 μm wide parallel lines, perpendicular to the trenches. Applying a voltage between the top and bottom electrodes leads to uniaxial expansion of the membrane at the intersection of the bottom electrodes and the trenches. To characterize the in-plane strain, an array of 4 μm diameter aluminum dots is deposited on each actuator. The position of each dot is tracked, allowing displacement and strain profiles to be measured as a function of voltage. The uniaxial strain reaches 4.7% at 2.9 kV with a 0.2 s response time, sufficient to stimulate most cells with relevant biological strains and frequencies.

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“…However, conventional patterning processes based on photoresist methods are difficult to be applied to fragile structures, such as self-assembled monolayers (SAMs). Direct resistless patterning would provide a major improvement, such as the recently demonstrated thermal evaporation of nanostructures through miniature shadow masks (microstencils) [1].…”

Section: Introductionmentioning

confidence: 99%

Exploring microstencils for sub-micron patterning using pulsed laser deposition

et al. 2004

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The possibilities of sub-micron patterning by means of microstencils using pulsed laser deposition were investigated. Stencils with circular and elliptical patterns were used, with pore sizes ranging from 1 µm down to 500 nm. Strontium titanate (SrTiO 3 ), silicon (Si) and self-assembled monolayers on gold were used as substrate materials, whereas nickel (Ni), nickel oxide (NiO) and gold (Au) have been deposited. The results show that the chosen deposition setup makes an easy and fast way for high-quality pattern creation.

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Resistless patterning of sub-micron structures by evaporation through nanostencils

Cited by 147 publications

References 7 publications

Metallic Nanowires by Full Wafer Stencil Lithography

Metallic Nanowires by Full Wafer Stencil Lithography

Microfabrication and characterization of an array of dielectric elastomer actuators generating uniaxial strain to stretch individual cells

Exploring microstencils for sub-micron patterning using pulsed laser deposition

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