Resonance analysis for EMC improvement in integrated circuits

Bacher, Yann; Froidevaux, Nicolas; Dupre, Philippe; Braquet, Henri; Jacquemod, G.

doi:10.1109/emccompo.2015.7358330

Cited by 5 publications

(2 citation statements)

References 3 publications

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“…The interconnect radiation resistances, line inductances and capacitances continue to increase, causing a significant increase in power supply noise [3]. So, in order to ensure electromagnetic compatibility at the integrated circuit involves an effective reduction of noise sources and the sources of disturbances [4], [5]. Electromagnetic modeling becomes necessary to ensure a predictive approach to all the risks of disturbances induced by electromagnetic interference [6]- [8].…”

Section: Introductionmentioning

confidence: 99%

Capacitance study of integrated circuits matrix interconnects

Lakhlef

Benfdila

Belhimer

2021

IJEECS

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<span>Propagation delays and couplings between nearby lines affect the circuit performances (speed, power consumption) and operations. Propagation delays in longer lines can become critical compared to the clock frequency and can induce unwanted signals in neighboring lines ("crosstalk" phenomenon). Induced line capacitances can induce parasitic signals. Hence characterizing of these capacitances is of paramount importance. The present work deals with the analysis of capacitance of a multilayer conductor interconnect aiming for their possible exact extraction. We used three topologies of a microstrip conductor interconnects and identified the potential distributor and then computed the capacitance and inductance matrix using a finite element method. The first analysis dealt with parallel microstrip conductors and the second with two levels (plan) of a microstrip conductors the results are compared to those obtained by other methods and found quite encouraging.</span>

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Section: Introductionmentioning

confidence: 99%

Capacitance study of integrated circuits matrix interconnects

Lakhlef

Benfdila

Belhimer

2021

IJEECS

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“…The modeling of these facts becomes mandatory to ensure a predictive approach to the risks of EM-induced disruption [10,11]. This requires specific tools, models and EMC knowledge [12,13]. The designer of integrated circuits should consider the capacitances and inductances that were not considered in earlier times, because of the interconnection's lengths and the higher operating frequencies [14,15].…”

Section: Introductionmentioning

confidence: 99%

Investigation on EM radiations from interconnects in integrated circuits

2020

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Characterization and estimation of interconnections behavior in integrated circuits design before the implementation phase is of paramount importance. This behavior seen as microstrip antennas gets complex as the internal signal (square or sine waves) frequencies increase. Thus, they become the preferred path for the propagation of electromagnetic disturbances. In this work we have worked out the numerical modeling of the electromagnetic interactions characterizing the electromagnetic compatibility in the microstrip transmission lines. The effect of these electromagnetic interactions in different structures topologies are studied through the analysis of the influence of the supply signals frequency and structures. The spacing between transmission line tracks and the number of tracks superposition is modeled. The evolution and variation of the scheme parameters in the frequency domain are determined. The transmission lines are considered parallel of equal spacing and superposed tracks of equal spacing and thickness. The capacitance and inductance matrices are computed and discussed. The results are found to comply with current research outcomes.

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