2002
DOI: 10.1063/1.1515887
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Response to “Comment on ‘Effect of growth interruptions on the light emission and indium clustering of InGaN/GaN multiple quantum wells’ ” [Appl. Phys. Lett. 81, 3100 (2002)]

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Cited by 4 publications
(3 citation statements)
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“…First, the SLS is weakened with the decreasing growth rate, which accords with the reducing well width fluctuation due to the reducing growth rate. Second, references [23,25] have demonstrated similar guess about SLS, which can further support our viewpoints. When the QW growth rate is reduced to 0.0088 nm/s, the localization effect is less significant and thus only a single PL peak induced by DLS appears for S15.…”
Section: Resultssupporting
confidence: 74%
“…First, the SLS is weakened with the decreasing growth rate, which accords with the reducing well width fluctuation due to the reducing growth rate. Second, references [23,25] have demonstrated similar guess about SLS, which can further support our viewpoints. When the QW growth rate is reduced to 0.0088 nm/s, the localization effect is less significant and thus only a single PL peak induced by DLS appears for S15.…”
Section: Resultssupporting
confidence: 74%
“…The large lattice mismatch between GaN and InN hinders the growth of high-quality interfaces and leads to the formation of a diffusive interface with poor photoluminescence (PL)/electroluminescence (EL) emission and carrier photogeneration efficiency [20,21,22,23]. A diffusive interface is often attributed to the migration of indium and gallium atoms through the spinodal decomposition process resulting in the formation of clusters and localization of charge carriers.…”
Section: Introductionmentioning
confidence: 99%
“…Metal oxides such as Y 2 O 3 , TiO 2 , Ta 2 O 5 , Al 2 O 3 , La 2 O 3 , and SrTiO 3 have been attractive candidates and have drawn great research interests. [8][9][10] In this article, an ultrathin HfO 2 layer was grown by molecular beam epitaxy ͑MBE͒. The formation of SiO 2 or metal silicates often occurs during the growth and subsequent thermal procedures.…”
Section: Introductionmentioning
confidence: 99%