Retarding the Cu–Sn and Ag–Sn intermetallic compounds by applying Cu–xZn alloy on micro-bump in novel 3D-IC technologies

Chen, Wei-Yu; Chou, Tsu-Wei; Tu, Wei; Chang, Hsin‐Yuan; Lee, Christine Jill; Duh, Jenq‐Gong

doi:10.1007/s10854-015-2691-2

Cited by 1 publication

(1 citation statement)

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“…The three-dimensional (3D) integrated circuit (IC) package has attracted considerable attention because of the expected physical limitations in the fabrication of high-scale semiconductor devices (Lee et al , 2013). Because of the compact nature of 3D IC technologies, micro-bump solders are integral components in the packaging of these circuits (Chen et al , 2015). In 3D IC, Cu-Sn bonding was selected as interconnection material, electroplated-evaporation bumping-formed Cu-Sn micro-bumps and purely electroplated Cu-Sn micro-bumps can be used in 3D IC, the microstructural studies on Cu-Sn micro-bumps were carried out to determine the causes for low resistance values after bonding (Murugesan et al , 2012).…”

Section: Introductionmentioning

confidence: 99%

Cu/SnAgCu/Cu TLP with different thicknesses for 3D IC

Zhang

Liu

Yang

et al. 2017

SSMT

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Purpose This paper aims to investigate Cu/SnAgCu/Cu transient liquid phase (TLP) bonding with different thicknesses for three-dimensional (3D) integrated circuit (IC). Design/methodology/approach This paper includes experiments and finite element simulation. Findings The growth rate of the intermetallic compound layer during TLP soldering was calculated to be 0.6 μm/s, and the small scallop-type morphology Cu6Sn5 grains can be observed. With the decrease in thickness in solder joint, the thickness of intermetallic compounds represents the same size and morphology, but the size of eutectic particles (Ag3Sn, Cu6Sn5) in the matrix microstructure decrease obviously. It is found that with the increase in thickness, the tensile strength drops obviously. Based on finite element simulation, the smaller value of von Mises demonstrated that the more reliability of lead-free solder joints in 3D IC. Originality/value The Cu/SnAgCu/CuTLPbondingwithdifferentthicknessesfor3D IC was investigated.

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Section: Introductionmentioning

confidence: 99%