RETRACTED ARTICLE: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages

Surendar, A.; Siswanto, Waluyo Adi; Alijani, Maryam; Alhaifi, K.; Salmani, Mohammad

doi:10.1007/s00542-019-04435-x

Cited by 9 publications

(4 citation statements)

References 33 publications

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“…Three leads are also used for electrical connection of gate, emitter and collector. It has to be mentioned that in the FEM simulation leads were not considered without losing accuracy of the results (Samavatian et al , 2018b, 2018a; Surendar et al , 2019). Coupled temperature-displacement modeling step analysis was used in the transient mode.…”

Section: Finite Element Modelingmentioning

confidence: 99%

An investigation on function of current type on solder joint degradation in electronic packages

Cai

Huang

Li³

et al. 2020

SSMT

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Purpose As in real applications several alternating current (AC) currents may be injected to the electronic devices, this study aims to analyze their effects on the lifetime of the solder joints and, consequently, shed the light on these effects at the design phase for other researchers to consider. Design/methodology/approach In this paper, the authors investigated on current waveform shapes on the performance and reliability of the solder joints in electronic package. Three common and extensively used current shapes in several simulations and experiments were selected to study their effects on the solder joint performance. Findings The results demonstrate a sever thermal swing and stress fluctuation in the solder joint induced in the case of triangle current type because the critical states lack any relaxation time. In fact, the stress intensification in the solder under application of the triangle current type has been shown to contribute to increasing brittle intermetallic compounds. An accelerated increase of on-state voltage of power semiconductor was also observed in under application of the triangle current type. Originality/value The originality of this paper is confirmed.

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Section: Finite Element Modelingmentioning

confidence: 99%

An investigation on function of current type on solder joint degradation in electronic packages

Cai

Huang

Li³

et al. 2020

SSMT

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“…(Jeong et al, 2023) have studied the effect of boundary conditions on fatigue life of BGA solder joints at board with mounted packages level under random vibration. (Surendar et al, 2019) have studied the effects of drop impact in the thermal cycling on creep-fatigue failure of SAC solder joints in BGA packages.…”

Section: Introductionmentioning

confidence: 99%

Hybrid model of the FEM method and the SAR algorithm to perform reliability-based design optimization of the solder joints in the BGA assembly

Reddad,

Zemzami,

Hami

et al. 2024

Preprint

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Metaheuristic optimization algorithms are powerful for solving complex optimization problems, almost when we lack information about the nature of their objective function. Meanwhile, the Finite Element Method (FEM) is a very powerful method for predicting and simulating the behavior of systems subjected to various stresses, whether electrical, thermal, mechanical, vibratory or magnetic. In the current study, we have proposed an optimization methodology that couples a metaheuristic algorithm - the Search and Rescue Algorithm (SAR) - with the finite element method. We then investigated the proposed methodology for optimizing the reliability of solder balls with respect to their geometry in a Ball Grid Array (BGA) assembly subjected to thermal cycling load. First, we performed a sensitivity analysis to determine the parameters influencing solder ball reliability, then we optimized the plastic deformation of solder balls, hence increasing their reliability as a function of their geometry through the proposed methodology, which results in improving the reliability of the entire electronic component.

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“…As previously mentioned, finite element simulation is considered the most reliable tool for extracting the creep-related parameters for solder joints in electronic devices in which constitutive equations are used. The results obtained from finite element simulation are then used in the thermo-mechanical fatigue lifetime prediction model (Xu and Nied, 2000;Surendar et al, 2019). A proposed model was presented by Huang et al (2020b) in which a wide temperature range's (À40°C to 120°C) effects were included in the constitutive model of a Sn-Ag-Cu solder based on the thermomechanical property tests for the power module.…”

Section: Introductionmentioning

confidence: 99%

Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

Olenev

Закиева

Smirnova³

et al. 2021

SSMT

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Purpose This study aims to present a more accurate lifetime prediction model considering solder chemical composition. Design/methodology/approach Thermal cycling and standard creep tests as well as finite element simulation were used. Findings The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved. Originality/value It is confirmed.

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RETRACTED ARTICLE: High-G drop effect on the creep-fatigue failure of SAC solder joints in BGA packages

Cited by 9 publications

References 33 publications

An investigation on function of current type on solder joint degradation in electronic packages

An investigation on function of current type on solder joint degradation in electronic packages

Hybrid model of the FEM method and the SAR algorithm to perform reliability-based design optimization of the solder joints in the BGA assembly

Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

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