Retrospective on VLSI value scaling and lithography

Abstract

In recent decades, the rate of shrinking integrated-circuit components has slowed as challenges accumulate. Yet, in part by virtue of an accelerating rate of cleverness, the end-user value of new semiconductor processes steadily advances. On top of the miniaturization benefits delivered by optical lithography, value is boosted by innovations in wafer processing, mask synthesis, materials and devices, microarchitecture, and circuit design. Focusing on three decades of microprocessor data enables quantification of how innovations from those domains have contributed over time to integrated-circuit "value scaling" in terms of performance, power, and cost. At some point, lateral shrinking will end altogether and the kinds of ingenuity emerging from those domains may provide clues for how very large-scale integration value creation will advance beyond that point.

Hysteresis in As-Synthesized MoS2 Transistors: Origin and Sensing Perspectives

“…In the last decades, the limitations in chip integration to achieve Moore's law density requirements have been overcome through the progressive scaling of the transistor dimensions (particularly channel length) [1,2], the incorporation of high-κ insulators [3] and the design of new device architectures (FinFet, SOI, trigate) [4] to achieve better control of the device performance. The advances in the lithography (deep ultraviolet (DUV) and multi-patterning techniques) have been employed to shrink the dimensions of transistors down-to sub-10 nm channel lengths [2]. However, to support more scaled process technologies, the half-pitch resolution should be improved.…”

Technology computer-aided design simulation of phonon heat transport in semiconductor devices

“…This approach has also led to an increase in the heat generation density. 1) Heat degrades the reliability and lifetime of ICs. 2) Considerable effort has been put into the design of ICs to alleviate this degradation; consequently, the heat generation density has been leveling off in recent years.…”

“…2) Considerable effort has been put into the design of ICs to alleviate this degradation; consequently, the heat generation density has been leveling off in recent years. 1) In order to realize such a design properly and quickly, it is essential to understand the thermal behavior of each component of an IC. Simulations will certainly help with such understanding.…”