Return loss of three types of arching bond wire structures for RF and microwave circuit applications

Chen, Hsing‐Yi; Tai, Chen-Hsien

doi:10.1002/mop.21807

Cited by 4 publications

(1 citation statement)

References 4 publications

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“…However, a bond wire adds a low-pass element to the microwave system and limits its operating bandwidth. Approaches using multiple bond wires [1][2][3][4][5] or compensated microstrip stubs [6][7][8][9][10][11] can broaden the bandwidth of such interconnections, but none of them exceed 20 GHz frequencies. It is more important that compensated open stubs are used to broaden the bandwidth of bond wire interconnection in [4][5][6][7], but in most cases, the required compensated open stubs must be narrower than 0.1 mm, which is impossible to fabricate based on current printed circuit substrate (PCB) or low temperature co-fired ceramic (LTCC) fabrication process.…”

Section: Introductionmentioning

confidence: 99%

Broadband Substrate to Substrate Interconnection

Zhang¹,

Cheng²,

Wang³

et al. 2015

PIER C

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Abstract-A broadband substrate to substrate microwave circuit interconnection is proposed using bond wires and defected ground structure (DGS). The proposed square-shaped DGS etched under compensated microstrip open stubs not only expands its operating bandwidth, but also increases the characteristic impedance of microstrip line without narrowing its width, which breaks the PCB fabrication limitation of narrow stubs. The proposed structure can make the impedance of the microstrip line much larger than that without DGS. A 250 Ω characteristic impedance is easily achieved using 0.6 mm microstrip line with the proposed DGS. Measured S 21 and S 11 of the proposed interconnection are better than −0.3 and −15 dB from DC to 38 GHz, respectively. A bandwidth increment of more than 1200% is achieved compared with the conventional one.

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Section: Introductionmentioning

confidence: 99%

Broadband Substrate to Substrate Interconnection

Zhang¹,

Cheng²,

Wang³

et al. 2015

PIER C

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Investigation of return loss for large numbers of bonding wires by FDTD method

Chen

2008

Micro & Optical Tech Letters

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The finite‐difference time domain (FDTD) model is validated first by comparing the simulation results of return losses for 1, 7, and 15 bonding wires fabricated on a test board with those obtained by the HFSS software. After checking its accuracy, the FDTD method is used to investigate the return loss for bonding wire arrays with numerous geometrical parameters. From simulation results, it is found that the return loss of bonding wires can be improved by using multiple wires placed in parallel in bonding wire arrays. It is also found that operation frequency shifts of bonding wire arrays can be achieved by changing the wire numbers in bonding wire arrays. It is also reveled that the return loss of bonding wire structures is a function of the bonding wire geometry, such as the spacing between adjacent wires, wire number, wire height above the substrate, and wire length. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 1575–1579, 2008; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.23425

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Investigation of return loss of 15 bonding wires fabricated on a test board by FDTD method

Chen

2007

2007 IEEE Antennas and Propagation Society International Symposium

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Return losses of 1~15 bonding wires fabricated on a test board for RF and microwave circuit applications are studied by the finite-difference time-domain (FDTD) method. In order to fit a cell size of 0.25 mm, an equivalent material obtained by the effective material property technique is applied to model bonding wires, the top metallic patch, and the bottom metallic layer. Simulation results of return losses obtained by the FDTD method are presented and compared with those obtained by the HFSS software at frequencies of 0.04~6 GHz. It is found that simulation results calculated by the FDTD method make a good agreement with those obtained by the HFSS software. It is also found that the return loss of bonding wires can be improved by using multiple wires placed in parallel in bonding wire arrays.

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Return loss of three types of arching bond wire structures for RF and microwave circuit applications

Cited by 4 publications

References 4 publications

Broadband Substrate to Substrate Interconnection

Broadband Substrate to Substrate Interconnection

Investigation of return loss for large numbers of bonding wires by FDTD method

Investigation of return loss of 15 bonding wires fabricated on a test board by FDTD method

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