2000
DOI: 10.1016/s0920-3796(00)00336-7
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Review of helium cooling for fusion reactor applications

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Cited by 23 publications
(15 citation statements)
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“…Extended surfaces increase the effective HTC by the following mechanisms: a reduced flow area in- creases the flow velocity, the hydraulic diameter is smaller, and finally the heat transfer area is increased; extended surfaces be provided by pin fins, by 2D or 3D surface roughness, or by using ribs. Table 1 gives a general idea about how various heat transfer enhancement methods contribute to an increase in HTC and in the friction factor (FF) over a smooth tube [14]. 2D and 3D roughness increases the HTC by breaking the laminar boundary layer near the wall [14].…”
Section: Helium Coolingmentioning
confidence: 99%
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“…Extended surfaces increase the effective HTC by the following mechanisms: a reduced flow area in- creases the flow velocity, the hydraulic diameter is smaller, and finally the heat transfer area is increased; extended surfaces be provided by pin fins, by 2D or 3D surface roughness, or by using ribs. Table 1 gives a general idea about how various heat transfer enhancement methods contribute to an increase in HTC and in the friction factor (FF) over a smooth tube [14]. 2D and 3D roughness increases the HTC by breaking the laminar boundary layer near the wall [14].…”
Section: Helium Coolingmentioning
confidence: 99%
“…Table 1 gives a general idea about how various heat transfer enhancement methods contribute to an increase in HTC and in the friction factor (FF) over a smooth tube [14]. 2D and 3D roughness increases the HTC by breaking the laminar boundary layer near the wall [14]. A swirl rod insert (SRI) uses a rod with fins in place of a twisted tape.…”
Section: Helium Coolingmentioning
confidence: 99%
“…Thus, if a certain liquid metal (or its alloys) with a low melting point is adopted as a cooling fluid, a much higher cooling capacity than that of traditional fluids can be obtained [15]. Starting from this basic point, Liu and Zhou [14] proposed for the first time the use of liquid metals or their alloys as cooling fluids for the thermal management of computer chips in 2002. Similarly, liquid metals are also a potential candidate coolant for nextgeneration coolants in general industrial heat exchangers because of their favorable properties, such as high thermal conductivity, high electrical conductivity, low vapor pressure, low dissolution in water, high boiling point above 2200°C, and true single-phase liquid cooling.…”
Section: Limitations Of Water-based Heat Exchangersmentioning
confidence: 99%
“…Recently, a new area in the IT industry has emerged since Liu and Zhou [14] proposed the use of liquid metals or their alloys as cooling fluids for the thermal management of computer chips. A number of works have been conducted, promising the exciting future of this thermal management frontier [15,16,94,95].…”
Section: Potential Application Of Liquid Metalsmentioning
confidence: 99%
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