Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging

Ruiyi, Li; Yang, Xiaona; Li, Jian; Shen, Yanan; Zhang, Lixin; Lu, Rui; Wang, Chunyang; Zheng, Xinghua; Chen, Haisheng; Zhang, Ting

doi:10.1016/j.mtphys.2021.100594

Cited by 145 publications

(100 citation statements)

References 136 publications

Supporting

Mentioning

100

Contrasting

Order By: Relevance

“…In the past decade, extensive work has been demonstrated to develop functional electronic packaging materials. [7,8] On the one hand, composition regulation, interface modification, and defect regulation show great potential in eliminating electromagnetic interference. [9] Such as, 2D SnO/ SnO 2 heterojunctions were successfully fabricated by controlled oxidation using SnO nanosheets as templates.…”

Section: Doi: 101002/smll202204303mentioning

confidence: 99%

Multifunctional Epoxy‐Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy

Qian

Luo

Haruna

et al. 2022

Small

View full text Add to dashboard Cite

show abstract

Section: Doi: 101002/smll202204303mentioning

confidence: 99%

Multifunctional Epoxy‐Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy

Qian

Luo

Haruna

et al. 2022

Small

View full text Add to dashboard Cite

show abstract

“…To date, numerous examples of TIMs with directional heat transfer have been obtained using aligned graphitic or metallic anisotropic fillers. [9] However, the use of electrically conductive materials is a problem in high power density electronics due to electric arc issues. Furthermore, the direction of heat transfer has mostly been studied through the thickness of the TIMs which would be a problem in vertical stacks of electronic chips.…”

Section: Introductionmentioning

confidence: 99%

Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging

Peng

Liu

et al. 2022

Advanced Materials

View full text Add to dashboard Cite

Miniaturized and high‐power‐density 3D electronic devices pose new challenges on thermal management. Indeed, prompt heat dissipation in electrically insulating packaging is currently limited by the thermal conductivity achieved by thermal interface materials (TIMs) and by their capability to direct the heat toward heat sinks. Here, high thermal conductivity boron nitride (BN)‐based composites that are able to conduct heat intentionally toward specific areas by locally orienting magnetically functionalized BN microplatelets are created using magnetically assisted slip casting. The obtained thermal conductivity along the direction of alignment is unusually high, up to 12.1 W m−1 K−1, thanks to the high concentration of 62.6 vol% of BN in the composite, the low concentration in polymeric binder, and the high degree of alignment. The BN composites have a low density of 1.3 g cm−3, a high stiffness of 442.3 MPa, and are electrically insulating. Uniquely, the approach is demonstrated with proof‐of‐concept composites having locally graded orientations of BN microplatelets to direct the heat away from two vertically stacked heat sources. Rationally designing the microstructure of TIMs to direct heat strategically provides a promising solution for efficient thermal management in 3D integrated electronics.

show abstract

“…With the continuous development of modern communication technology, electronic equipment is moving towards a high degree of integration and miniaturization, while the energy consumption of the chips inside the electronic equipment is constantly increasing. [1][2][3][4][5] This energy consumption increasing of electronic equipment leads to an increase in the internal temperature of electronic equipment, which in turn affects the life and stability of the equipment. [6][7][8][9][10][11][12] Improving the heat dissipation capacity of cooling systems is an effective way to reduce the temperature rise of electronic equipment.…”

Section: Introductionmentioning

confidence: 99%

Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero‐structured GF/BN networks

Liu

et al. 2022

J of Applied Polymer Sci

View full text Add to dashboard Cite

Due to the rapid development of multifunctional and miniaturized electronic devices, the demand for polymer composites with mechanical properties, highthermal conductivity, and dielectric properties is increasing. Therefore, the heat dissipation capacity of the composite must be improved. To solve this problem, we report a glass fabric (GF)/boron nitride (BN) network with a highly thermally conductive hetero-structured formed using polyvinyl alcohol (PVA) as an adhesive. The GF and BN are furtherly modified by (3-aminopropyl)triethoxysilane (APTES) for better thermal conductivity enhancement. When the BN content is 30%, the thermal diffusion coefficient and thermal conductivity of obtained PVA-mBN@mGF (PBG) are 2.843 mm 2 /s and 1.394 W/(m K), respectively. Epoxy (EP) resin is then introduced to prepare PBG/mBN/EP laminated composites via the hot pressing method as applied as thermal conductive composites. A highest thermal conductivity of 0.67 W/(m K) of PBG/mBN/EP laminated composites is obtained, three times higher than that of pure EP. In addition, the PBG/mBN/EP laminated composites also present favorable mechanical, electrically insulating, and dielectric properties.

show abstract

Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging

Cited by 145 publications

References 136 publications

Multifunctional Epoxy‐Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy

Multifunctional Epoxy‐Based Electronic Packaging Material MDCF@LDH/EP for Electromagnetic Wave Absorption, Thermal Management, and Flame Retardancy

Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging

Enhancement of thermal conductivity for epoxy laminated composites by constructing hetero‐structured GF/BN networks

Contact Info

Product

Resources

About