RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

RF Characterization and Analytical Modelling of Through Silicon Vias and Coplanar Waveguides for 3D Integration

“…The inductance linearly increases from 0.13 to 0.33 nH for 40-to 320--long lines, with an inductance per meter of for the line. This value is fully consistent with standard values for CPWs found in literature for similar dimensions [5], [7], [16]. The extracted inductance of one via is at frequencies below 100 MHz.…”

“…The main contribution to the total inductance depends on the length of the line. This inductance value is proportionally two times lower than inductance obtained for moderate aspect ratio vias described in [6] and [7], and 500-1000 times lower than wire bonding, making TSV very attractive for 3D integration. The resonance peaks fall at the resonance peaks already described in the resistance curves.…”

“…Obviously, a basic model with RLC series is not sufficient to match the measured resonance frequencies, the capacitance and inductance levels independently, as has already been observed by others [19], [20]. In contrast a numerical simulation is very often to opaque and does not give a simple explanation for a certain behavior [7], [8]. Here, we propose an advanced analytical model for the lines+vias system, which is presented in Fig.…”

“…In addition, the RF data are not always linked to the dc behavior and other via properties. The RF characterization is either done on one-port reflective RF structures ( [5], [6]), or on low aspect ratio ( 5) vias ( [7], [8]). In terms of modelling, the existing papers on TSV simulations are using complicated numerical techniques like finite element methods, with no clear links to the processing and the real measurements [7], [8].…”

Insights into Three-Dimensional Radiofrequency Circuits Connections

“…Vias are interconnects commonly found on multilayer printed or integrated circuits [13][14]. Often, they provide some path to ground or to other device via some RDL (Re-Distribution Layer).…”