Meeting the ever increasing demand for transmission capacity in wireless networks will require evolving towards higher regions in the radiofrequency spectrum, reducing cell sizes as well as resorting to more compact, agile and power efficient equipment at the base stations, capable of smoothly interfacing the radio and fiber segments. Photonic chips with fully functional microwave photonic systems are promising candidates to achieve these targets. Over the last years, many integrated microwave photonic chips have been reported in different technologies. However, and to the best of our knowledge, none of them have fully integrated all the required active and passive components. Here, we report the first ever demonstration of a microwave photonics tunable filter completely integrated in an Indium Phosphide chip and packaged. The chip implements a reconfigurable RF-photonic filter, it includes all the required elements, such as lasers, modulators and photodetectors, and its response can be tuned by means of control electric currents. This demonstration is a fundamental step towards the feasibility of compact and fully programmable integrated microwave photonic processors.Emerging information technology scenarios, such as 5G mobile communications and Internet of Things (IoT), will require a flexible, scalable and future-proof solution capable for seamlessly interfacing the wireless and fiber segments of communication networks [1,2,3]. Microwave photonics (MWP) [4,5],the interdisciplin ary approach that combines radiofrequency and photonic systems, is the best positioned technology to achieve this target. A very relevant example is 5G wireless communications, which targets an extremely ambitious range of requirements including [6,7], a 1000-fold increase in capacity, connectivity for over 1 billion users, strict latency control, as well as network flexibility via agile software programming. These objectives call for a paradigm shift in the access network to incorporate smaller cells, exploit the millimeter wave regions of the radiofrequency spectrum and implement massive multiple-input multiple-output at the base stations (BTSs) [7]. The successful integration of the wireless and fiber segments thus relies on the possibility of implementing agile and reconfigurable MWP subsystems, featuring broadband operation, as well as low space, weight and power consumption metrics. The solution consists in resorting to integrated microwave photonics (IMWP) [8,9] chips allocated either in the BTS and/or the central office in combination with radio over fiber transmission in the fiber segment connecting them [10,11]. The two fundamental issues to be solved in IMWP are related respectively to technology and architecture. First, there is the need to identify the best material platform where to implement MWP chips. Second, whether it would be better to follow an application specific photonic integrated circuit (ASPIC) approach, where a specific architecture is employed to implement a specific functionality, or to resort to a ...