AlGaN/GaN/Si metal-insulator-semiconductor heterostructure field-effect transistors (MISHFETs) with SiN and Al 2 O 3 gate insulators are characterized by static and high-frequency measurements, and their performance is compared with nonpassivated and SiN-passivated heterostructure field-effect transistors (HFETs). The saturation drain current increased from ∼500 mA mm −1 for the HFETs to ∼770 mA mm −1 for the MISHFETs. The peak extrinsic transconductance of the MISHFETs (147 mS mm −1 for 8 nm SiN and 220 mS mm −1 for 4 nm Al 2 O 3 ) is higher than expected due to the increased gate-to-channel separation. Similarly, small signal microwave characterization yielded an increase in the current gain cut-off frequency (from 3.2 to 7.2 GHz) and the maximum frequency of oscillation (from 12.3 to 20.4 GHz) for the MISHFETs with 2 μm gate length compared to the HFET counterparts. Finally, the density of trap states, evaluated from the frequency-dependent conductance measurements, was ∼ =3 × 10 12 cm −2 eV −1 for the HFETs but only ∼ =1.8 × 10 12 cm −2 eV −1 for the MISHFETs. All of these demonstrate the capability of AlGaN/GaN MISHFETs of preparing high-performance and cost-effective devices for high-power microwave applications on a Si substrate.when compared with sapphire. Unfortunately, high-resistive SiC substrates are a costlier alternative to AlGaN/GaN devices. Devices on Si 8 , on the other hand, are the best solution considering their low cost, high crystalline perfection, good thermal conductivity and large-area availability of Si substrates.Recently, an excellent millimetre-wave performance (e.g. maximum frequency of oscillation of 110 GHz and noise figure of 1.3 dB at 20 GHz) has been reported on AlGaN/GaN-on-Si HFETs [1].