RF power LDMOSFET characterization and modeling for reliability issues: DC and RF performances

Chetibi, P.M.; Gares, M.; Masmoudi, Mohamed; Maanane, Hichame; Marcon, J.; Mourgues, K.; Eudeline, Philippe

doi:10.1109/icmel.2008.4559250

Cited by 4 publications

(3 citation statements)

References 3 publications

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“…La Tabla 1 resume los resultados de las medidas mostrando una eficiencia de drenaje de las dos etapas del 40 % para la frecuencia más alta. En el presente trabajo, para anticipar los resultados de las medidas durante la fase de diseño, se modificaron los modelos ROOT y MET electrotérmico [11] para el dispositivo de prueba antes señalado. La manera de modificarlos a través de la técnica de los voltajes efectivos fue mencionada en [9].…”

Section: Resultsunclassified

Mejoras del proceso de diseño en la industria de transistores de microondas

Rafael-Valdivia

2019

Rev. Fac. Ing.

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Este artículo presenta una técnica para mejorar el proceso de diseño industrial de transistores de microondas, basado en un diseño de experimentos mejorado (DOE) y un modelado electrotérmico (MET) expandido. El diseño de experimentos DOE permitió centrar el diseño a través de variaciones en parámetros específicos, para evitar complejas simulaciones electromagnéticas de acoplamiento mutuo entre los cables dentro del mismo transistor, que generalmente en herramientas CAD convencionales presentan un elevado costo computacional. El modelo electrotérmico mejorado utilizando la técnica de voltajes efectivos posibilitó predecir no solo el autocalentamiento, sino también las impedancias apropiadas para la máxima potencia de salida y la máxima eficiencia del transistor. De esta manera fue posible elegir las condiciones de operación que garantizaran un reducido autocalentamiento, así como las mejores condiciones de potencia, eficiencia y linealidad. Las técnicas presentadas son útiles para la implementación de amplificadores de potencia en los futuros sistemas de comunicación inalámbricos, ya que deben trabajar con potencias elevadas que producen autocalentamiento y con señales de gran ancho de banda. La combinación de ambas técnicas permite la reducción de diseño y tiempo de producción en el ámbito industrial. El diseño de experimento mejorado posibilitó centrar el diseño del transistor para asegurar la obtención de los mejores desempeños del transistor. La caracterización térmica facilitó que el transistor de microondas, implementado en un circuito impreso de potencia, funcionara por debajo de la temperatura máxima permitida, lo que garantiza su vida útil y, en consecuencia, la confiabilidad del sistema de transmisión completo.

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Section: Resultsunclassified

Mejoras del proceso de diseño en la industria de transistores de microondas

Rafael-Valdivia

2019

Rev. Fac. Ing.

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“…The extraction of current and capacitance parameters of the model is performed from I-V and C-V measurements data respectively, using an optimization program implemented in ICCAP to fit simulations with measurements. Small-signal simulations are performed to validate the model for small signal operation (Chetibi-Riah et al, 2008). Fig.…”

Section: Extraction Of Current and Capacitances Parameters Of The Modelmentioning

confidence: 99%

Micro Electronic and Mechanical Systems

Takahata¹

2009

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and 2005, respectively. He held industrial research positions with Panasonic in Japan and 3M in USA, conducting R&D of micro devices and fabrication technologies for over ten years. Presently, he is an Assistant Professor at the University of British Columbia, Canada, as well as a Canada Research Chair. Prof. Takahata has published many papers and holds several issued patents in MEMS and micro/nanofabrication. He has served on committees for international conferences such as the IEEE MEMS and the IEEE Transducers. He also served as the editor of an InTech book Micro Electronic and Mechanical Systems. His research interests are in the areas of MEMS, nanotechnology, and micro/nanomanufacturing, including wireless microdevices, bioMEMS, nanomaterials and microstructures integration, and microplasma control and application. PrefaceThe miniaturization and performance improvement in semiconductor devices and integrated circuits (ICs) are expected to continue through leveraging of nanotechnologies and nanomaterials. This evolution should accelerate the System-on-a-Chip (SoC) trend, i.e., singlechip integration of multifunctional, mixed-signal electronic components, toward realizing embedded nanoelectronic systems. In parallel with advances in electronics, we are witnessing the rise of micro-electro-mechanical systems (MEMS), with rapidly growing commercial opportunities and markets extending to a broader range of industrial sectors on a global scale.The emergence of MEMS is primarily attributed to the establishment of sophisticated IC manufacturing techniques and processes that served as a foundation for realizing many innovative silicon-based micromachining technologies. Advances in this area have brought about a revolution in mechanical engineering, enabling the miniaturization and system-level integration of mechanical structures and devices with ICs on a chip for MEMS fabrication. With miniaturized sensors and actuators, MEMS provide us with the ability to interact with micro-scale environments with non-electrical/-electronic parameters, found in the mechanical, optical, chemical, biological, and other domains. This exceptional ability has led to their application in fields ranging from implantable medical sensors to video game controllers. There is no doubt that continued development of MEMS and microsystems with electromechanical functionalities will extend their contribution to society, in parallel with the evolution of IC technologies.This book discusses key aspects of these technology areas, organized in twenty-seven chapters that present the latest research developments in micro electronic and mechanical systems. The book addresses a wide range of fundamental and practical issues related to MEMS, advanced metal-oxide-semiconductor (MOS) and complementary MOS (CMOS) devices, SoC technology, integrated circuit testing and verification, and other important topics in the field. Several chapters cover state-of-the-art microfabrication techniques and materials as enabling technologies for the microsystems. Reliabili...

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“…6. The model includes new parasitic elements, series inductances, for modelling parasitic effects of the transistor topology (Chetibi-Riah et al, 2008). Self-heating effect is treated with a special circuit as shown in Fig.…”

Section: Model Extractionmentioning

confidence: 99%