The host effect of
the supramolecular [Ga4L6]12– tetrahedral metallocage on reductive elimination
of substrate by encapsulated Au(III) complexes is investigated by
means of computational methods. The behavior of the reactants in solution
and within the metallocage is initially evaluated by means of classical
molecular dynamics simulations. These results guided the selection
of proper computational models to describe the reaction in solution
and inside the metallocage at the DFT level. The calculated Gibbs
energy barriers are in very good agreement with experiment both in
solution and inside the metallocage. The analysis in solution revealed
that microsolvation around the Au(III) complex increases the Gibbs
energy barrier. The analysis within the metallocage shows that its
encapsulation favors the reaction. The process can be formally described
as removing explicit microsolvation around the gold complex and encapsulating
the metal complex inside the metallocage. Both processes are important
for the reaction, but the removal of the solvent molecules surrounding
the Au(III) metal complex is fundamental for the reduction of the
reaction barrier. The energy decomposition analysis of the barrier
among strain, interaction, and thermal terms shows that strain term
is very low whereas the contribution of thermal (entropic) effects
is moderate. Interestingly, the key term responsible for reducing
the Gibbs energy barrier is the interaction. This term can be mainly
associated with electrostatic interactions in agreement with previous
examples in the literature.