Robust and stretchable indium gallium zinc oxide-based electronic textiles formed by cilia-assisted transfer printing

Yoon, Jongwon; Jeong, Yunkyung; Kim, Heeje; Yoo, Seonggwang; Jung, Hoon; Kim, Yonghun; Hwang, Young‐Kyu; Hyun, Yujun; Hong, Woong Ki; Lee, Byoung Hun; Choa, Sung‐Hoon; Ko, Heung Cho

doi:10.1038/ncomms11477

Cited by 77 publications

(55 citation statements)

References 44 publications

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“…Yoon et al 141 introduced an artificial cilia structure at the periphery regions of stretchable electronic platforms as adhesive elements to facilitate transfer printing. Using this strategy, an ultrathin layer of indium gallium zinc oxide as the basis of a 7-stage ring oscillator was successfully transferred onto a handkerchief, as shown in Figure 7d.…”

Section: Textile Designmentioning

confidence: 99%

Design and application of ‘J-shaped’ stress–strain behavior in stretchable electronics: a review

et al. 2017

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A variety of natural biological tissues (e.g., skin, ligaments, spider silk, blood vessel) exhibit ‘J-shaped’ stress-strain behavior, thereby combining soft, compliant mechanics and large levels of stretchability, with a natural ‘strain-limiting’ mechanism to prevent damage from excessive strain. Synthetic materials with similar stress-strain behaviors have potential utility in many promising applications, such as tissue engineering (to reproduce the nonlinear mechanical properties of real biological tissues) and biomedical devices (to enable natural, comfortable integration of stretchable electronics with biological tissues/organs). Recent advances in this field encompass developments of novel material/structure concepts, fabrication approaches, and unique device applications. This review highlights five representative strategies, including designs that involve open network, wavy and wrinkled morphoologies, helical layouts, kirigami and origami constructs, and textile formats. Discussions focus on the underlying ideas, the fabrication/assembly routes, and the microstructure-property relationships that are essential for optimization of the desired ‘J-shaped’ stress-strain responses. Demonstration applications provide examples of the use of these designs in deformable electronics and biomedical devices that offer soft, compliant mechanics but with inherent robustness against damage from excessive deformation. We conclude with some perspectives on challenges and opportunities for future research.

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Section: Textile Designmentioning

confidence: 99%

Design and application of ‘J-shaped’ stress–strain behavior in stretchable electronics: a review

et al. 2017

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“…Figure 7 describes the fabrication technique and the conducting fabrics. Recently, transfer printing [90], printable elastic conductors [91][92][93], and conductive liquid metals [94,95] are becoming popular in this area. Printable elastic conductors made from silver flakes, a fluorine rubber, and a fluorine surfactant were developed by Matsuhisa et al [96] at the University of Tokyo in Japan.…”

Section: Stretchable and Flexible Interconnects And Conductive Textilesmentioning

confidence: 99%

Recent Advances in Soft E-Textiles

Mondal

2018

Inventions

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E-textiles (electronic textiles) are fabrics that possesses electronic counterparts and electrical interconnects knitted into them, offering flexibility, stretchability, and a characteristic length scale that cannot be accomplished using other electronic manufacturing methods currently available. However, knitting is only one of the technologies in e-Textile integration. Other technologies, such as sewing, embroidery, and even single fiber-based manufacture technology, are widely employed in next-generation e-textiles. Components and interconnections are barely visible since they are connected intrinsically to soft fabrics that have attracted the attention of those in the fashion and textile industries. These textiles can effortlessly acclimatize themselves to the fast-changing wearable electronic markets with digital, computational, energy storage, and sensing requirements of any specific application. This mini-review focuses on recent advances in the field of e-textiles and focuses particularly on the materials and their functionalities.

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“…In recent years, electronic textiles (e-textiles) have attracted significant research attention with respect to the development of new biological information monitoring systems [1][2][3][4][5][6], human interface systems [7,8], and fashions [9,10], among other schemes [11][12][13][14][15][16][17][18]. At present, only conductive tracks and pads and several types of sensors can be formed on a textile by weaving, knitting, and stitching of conductive yarns on the textile [9,[19][20][21], or by printing of conductive inks on the textiles [3,22,23].…”

Section: Introductionmentioning

confidence: 99%

Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns

2020

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For the improvement of the performance and function of electronic textiles (e-textiles), methods for electronic component mounting of textile circuits with electrical and mechanical durability are necessary. This manuscript presents a component mounting method for durable e-textiles, with a simpler implementation and increased compatibility with conventional electronics manufacturing processes. In this process, conductive patterns are directly formed on a textile by the printing of conductive ink with deep permeation and, then, components are directly soldered on the patterns. The stiffness of patterns is enhanced by the deep permeation, and the enhancement prevents electrical and mechanical breakages due to the stress concentration between the pattern and solder. This allows components to be directly mounting on textile circuits with electrical and mechanical durability. In this study, a chip resistor was soldered on printed patterns with different permeation depths, and the durability of the samples were evaluated by measuring the variation in resistance based on cyclic tensile tests and shear tests. The experiments confirmed that the durability was improved by the deep permeation, and that the samples with solder and deep permeation exhibited superior durability as compared with the samples based on commercially available elastic conductive adhesives for component mounting. In addition, a radio circuit was fabricated on a textile to demonstrate that various types of components can be mounted based on the proposed methods.

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Robust and stretchable indium gallium zinc oxide-based electronic textiles formed by cilia-assisted transfer printing

Cited by 77 publications

References 44 publications

Design and application of ‘J-shaped’ stress–strain behavior in stretchable electronics: a review

Design and application of ‘J-shaped’ stress–strain behavior in stretchable electronics: a review

Recent Advances in Soft E-Textiles

Electronic Component Mounting for Durable E-Textiles: Direct Soldering of Components onto Textile-Based Deeply Permeated Conductive Patterns

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