Robust, highly customizable, and economical multi-channel electrode for chronic multi-unit recording in behaving animals

Tateyama, Yukina; Oyama, Kei; Shiraishi, Masaru; Iijima, Toshio; Tsutsui, Ken

doi:10.1016/j.neures.2017.07.003

Cited by 2 publications

(2 citation statements)

References 14 publications

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“…There are two types of connections, direct and indirect, as shown in Fig.1A. The direct interconnection integrates electrodes and amplifiers through a CMOS process to achieve a high-density fan-out [16,17], but this method is currently not applicable to flexible electrodes. The indirect one is usually based on a welding process that first connects the electrodes to the chip or connector and then to the data acquisition system.…”

Section: Introductionmentioning

confidence: 99%

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A Scalable and Adaptive Ultra-high-density Fan-out Strategy for High-throughput Flexible Microelectrodes

Zhang

Wang

Yang

et al. 2022

Preprint

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Flexible neural microelectrodes demonstrate higher compliance and better biocompatibility than rigid electrodes. They have multiple microfilaments can be freely distributed across different brain regions. However, high-density fan-out of high-throughput flexible microelectrodes remains a challenge since monolithic integration between electrodes and circuits is not currently available as it is for silicon electrodes. Here, we proposed a high-density fan-out strategy for high-throughput flexible electrodes. The flexible electrodes are partially overlapped on the printed circuit board (PCB). A modified wire bonding method is used to reduce the pads area on the PCB. Both the traces and pads on the PCB are optimized to minimize the back-end package. It is significantly reducing the connection area. In addition, the vertical rather than horizontal connection between the connector and the PCB further decrease the volume of the package. 1024 channel flexible electrodes are bonded to the high-density PCB within an area of 11.8*10mm2, and the success connection rate can reach 100%. The high-density fan-out strategy proposed in this paper can effectively reduce the volume of high-throughput flexible electrodes after packaging, which facilitates the miniaturization of in vivo multichannel recording devices and contributes to long-term recording.

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Section: Introductionmentioning

confidence: 99%

“…1A. The direct interconnection integrates electrodes and amplifiers through a CMOS process to achieve a high-density fan-out [16,17], but this method is currently not applicable to flexible electrodes.…”

Section: Introductionmentioning

confidence: 99%