2009
DOI: 10.1063/1.3279131
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Role of germanium in the reduced temperature dependence of Ti-based nanocrystals formation for nonvolatile memory applications

Abstract: We investigated the physical and electrical characteristics of Ti-based nanocrystals ͑NCs͒ with composition of germanium fabricated by cosputtering titanium silicide and germanium targets for low temperature applications of nonvolatile memory. The addition of Ge significantly reduces the thermal budget necessary for Ti-based NCs formation to 500°C in 2 min due to the rise of its morphological instability and agglomeration properties. Compositions characteristics were analyzed by x-ray photon-emission spectrosc… Show more

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Cited by 20 publications
(11 citation statements)
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“…However, when the voltage sweep reached ±40 V, the memory window slightly decreased due to the polarization effect from the SWCNTs stack. A similar increase in the memory window, with an increasing voltage sweep, was reported by several groups [27,28].…”
Section: Resultssupporting
confidence: 86%
“…However, when the voltage sweep reached ±40 V, the memory window slightly decreased due to the polarization effect from the SWCNTs stack. A similar increase in the memory window, with an increasing voltage sweep, was reported by several groups [27,28].…”
Section: Resultssupporting
confidence: 86%
“…[http://dx.doi.org/10.1063/1.4962655] Nowadays, non-volatile flash memory based products, such as digital cameras, laptops, MP4 players, and mobile phones, have attracted great attention over the last decades. 1,2 According to the prediction from the international technology roadmap for semiconductors (ITRS, 2013), 3 semiconductor manufacturing will enter an age of 5 nm technology in the year 2020. Following the conventional Si technology-based non-volatile flash memory advantages, an electronic device with ultrahigh storage density, low power consumption, and prolong retention time is urgently demanded in the near future.…”
mentioning
confidence: 99%
“…Hence, Eq. (2) can be simplified as J ¼ kV 2 . In comparison with that (J ¼ ckV 2 , c ( 1) in a forward sweeping direction (0 !…”
mentioning
confidence: 99%
“…1 However, flash memory is facing several challenges such as scalability limits, slow write/erase speed, and high power consumption. 2,3 Therefore, researchers have considered new storage materials and novel structures in nonvolatile memory devices to replace the conventional floating gate flash. Leading contenders currently include phase change memory, magnetic random access memory, ferroelectric random access memory, and resistive random access memory (RRAM).…”
mentioning
confidence: 99%