“…Low-melting glass frit must be able to etch through the SiN x :H layer without damaging the emitter layer, thereby exposing the emitter surface and establishing electrical contact between the silicon and the silver contact [2,3]. In the metallization procedure, the glass frit melts could wet and dissolve the Ag powder at elevated temperature to generate a liquid glassy-phase, which would facilitate the sintering of Ag powder [2,4,5]. The flow behavior of the glassy-phase, to a degree, is associated with the capillary attraction force caused by the tiny spacing between Ag particles, and it also depends on the wetting ability of the glassy-phase itself to the anti-reflection layer [5].…”