Role of phosphorus in the electrochemical behavior of electroless Ni-P alloys in 3.5 wt.% NaCl solutions

Lo, Ping‐Ho; Tsai, Wen‐Ta; Lee, Ju-Tung; Hung, Mei-Chuan

doi:10.1016/s0257-8972(05)80023-4

Cited by 101 publications

(30 citation statements)

References 27 publications

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“…The anodic current density increases slowly with potential moving to more positive. The second region is at potentials above −0.1 V, where the transpassive dissolution of Ni/P alloys begins, and the anodic current density increases quickly with the potential of moving toward a positive direction 33, 34…”

Section: Resultsmentioning

confidence: 99%

The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

Wang

Hong

2009

AIChE Journal

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Bi 3þ -complex ion is presented here as a less toxic stabilizer for use in electroless nickel plating (ENP) to replace the existing Pb 2þ ion stabilizer. The asymmetric derivatives of EDTA are identified to be a type of coordination ligands that can combine with Bi 3þ ions to form soluble complexes in the acidic ENP solution. In the ENP system studied the Bi 3þ -complex ion displays a critical stabilizer concentration of about 10 À5 mol/L, that is, the percolation concentration over which the ENP rate drops sharply. Besides the experimental measurement, deposition rates of both Ni and P are also simulated by using a kinetic model that has been derived from the double electric layer theory. The Bi 3þ -complex ion, behaving like conventional Pb 2þ ion, stabilizes ENP bath through the chemical replacement reaction at the surface of Ni deposition layer and results in a passive plating surface. This investigation also verifies the properties of the EN deposit, which are insignificantly affected by the length of service time of the plating solution by employing Bi 3þ -complex ion stabilizer.

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Section: Resultsmentioning

confidence: 99%

The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

Wang

Hong

2009

AIChE Journal

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“…6(a). On the basis of published data [44][45][46][47][48], it is suggested that complex and amorphous CaP compounds are formed during the MAO or (and) immersion process, which contributes to the presence of Ca 2p peak at 345.0 eV ( Fig. 6(a)) and P 2p peaks at 130.0 and 131.4 eV ( Fig.…”

Section: Xps Analysismentioning

confidence: 99%

In vitro degradation and electrochemical corrosion evaluations of microarc oxidized pure Mg, Mg–Ca and Mg–Ca–Zn alloys for biomedical applications

Pan

Wang

et al. 2015

Materials Science and Engineering: C

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“…Lo et al [12] studied the effect of phosphorus content on electrochemical behavior of coated materials in 3.5 wt.% NaCl. The authors reported that the corrosion potential, E corr , was shifted to more negative values, and the anodic current density increased in the case of low-phosphorus Ni-P coatings when compared to high-phosphorus Ni-P coatings.…”

Section: Introductionmentioning

confidence: 99%

Improvement of AZ91 Alloy Corrosion Properties by Duplex NI-P Coating Deposition

et al. 2020

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The corrosion behavior of duplex Ni-P coatings deposited on AZ91 magnesium alloy was studied. The electroless deposition process of duplex Ni-P coating consisted in the preparation of low-phosphorus Ni-P coating (5.7 wt.% of P), which served as a bond coating and high-phosphorus Ni-P coating (11.5 wt.% of P) deposited on it. The duplex Ni-P coatings with the thickness of 25, 50, 75 and 100 µm were deposited on AZ91 magnesium alloy. The electrochemical corrosion behavior of coated AZ91 magnesium alloy was investigated by electrochemical impedance spectroscopy and potentiodynamic polarization method in 0.1 M NaCl. Obtained results showed a significant improvement in the corrosion resistance of coated specimens when compared to uncoated AZ91 magnesium alloy. From the results of the immersion tests in 3.5 wt.% NaCl, 10% solution of HCl and NaOH and 5% neutral salt spray, a noticeable increase in the corrosion resistance with the increasing thickness of the Ni-P coating was observed.

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Role of phosphorus in the electrochemical behavior of electroless Ni-P alloys in 3.5 wt.% NaCl solutions

Cited by 101 publications

References 27 publications

The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

In vitro degradation and electrochemical corrosion evaluations of microarc oxidized pure Mg, Mg–Ca and Mg–Ca–Zn alloys for biomedical applications

Improvement of AZ91 Alloy Corrosion Properties by Duplex NI-P Coating Deposition

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Role of phosphorus in the electrochemical behavior of electroless Ni-P alloys in 3.5 wt.% NaCl solutions

Cited by 101 publications

References 27 publications

The role of Bi3+‐complex ion as the stabilizer in electroless nickel plating process

The role of Bi3+‐complex ion as the stabilizer in electroless nickel plating process

In vitro degradation and electrochemical corrosion evaluations of microarc oxidized pure Mg, Mg–Ca and Mg–Ca–Zn alloys for biomedical applications

Improvement of AZ91 Alloy Corrosion Properties by Duplex NI-P Coating Deposition

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The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process

The role of Bi³⁺‐complex ion as the stabilizer in electroless nickel plating process