Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating

Tseng, Chien-Fu; Lee, Christine Jill; Duh, Jenq‐Gong

doi:10.1016/j.msea.2013.03.015

Cited by 26 publications

(5 citation statements)

References 21 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…It is due to the fact that the growth of (Cu, Ni) 6 Sn 5 layer could be controlled by copper diffusion in the tin(copper) toward the interface. Similar studies were reported by [8,9].…”

Section: Intermetallic Morphology In Multiple Reflows: Top View Examisupporting

confidence: 90%

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn‐4.0 Ag‐0.5Cu/ENImAg

Adawiyah

Hafiz

Azlina

et al. 2019

Materialwissenschaft Werkst

View full text Add to dashboard Cite

The effect of intermetallic compound layer between Sn‐4.0 Ag‐0.5Cu solder bump and electroless nickel/immersion silver (ENImAg) surface finish under different cooling rate during multiple reflow condition was investigated. The results show that the interfacial (Cu, Ni)6Sn5 intermetallic compound were formed at the early stage after the first reflow process. After multiple reflow processes, both (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 appeared as needle‐shaped at interface due to the amount of copper concentration into a solder balls. The spalling intermetallic compound of (Cu, Ni)6Sn5 was spotted in the solder which was caused by the formation of needle‐shaped from the gaps of (Cu, Ni)6Sn5. The intermetallic compound thickness and grain sizes became thicker and coarser with increasing reflow time, respectively. The results also perceived that the cooling rate condition can influence the growth of intermetallic compound formation. Faster cooling rate produced thinner intermetallic layer as well as smaller grain sizes compared to slow cooling rate. Hence, the cooling rate is a necessary parameter in the solder reflow process because it has an impact on the microstructure of morphology and intermetallic growth.

show abstract

“…It is due to the fact that the growth of (Cu, Ni) 6 Sn 5 layer could be controlled by copper diffusion in the tin(copper) toward the interface. Similar studies were reported by [8,9].…”

Section: Intermetallic Morphology In Multiple Reflows: Top View Examisupporting

confidence: 90%

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn‐4.0 Ag‐0.5Cu/ENImAg

Adawiyah

Hafiz

Azlina

et al. 2019

Materialwissenschaft Werkst

View full text Add to dashboard Cite

show abstract

“…The solder with the TiO 2 doped UBM showed a smaller Q value, indicating more energy was needed for the Ni 3 Sn 4 layer growth. Jeong-Won Yoon et al reported the activation energy of Ni 3 Sn 4 in Sn-3.5Ag/Ni-P/Cu system to be 49 kJ/mol at temperatures from 100℃-170℃ for up to 60 days [4]. Chang-Bae Lee et al calculated the Q value in Sn-3.5Ag/Au/Ni-P joint to be 72.5 kJ/mol, and the aging condition was from 70℃-170℃ for as long as 60 days [23].…”

Section: Resultsmentioning

confidence: 99%

“…Electroless Ni-P has been recognized to be better than copper substrate during soldering due to its better barrier property. The characteristics of low cost, good solderability and uniform thickness make electroless Ni-P a constant focus in both industry and academia for years [1][2][3][4][5]. During the soldering process, Ni 3 Sn 4 is the primary IMC.…”

Section: Introductionmentioning

confidence: 99%

Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection

Yang

et al. 2014

Materials Science and Engineering: A

View full text Add to dashboard Cite

“…This formation can be explained by the earliest formation of binary Cu6Sn5 during reflow, followed by (Cu,Ni)6Sn5 after reflow process. It is due to the fact that the growth of (Cu,Ni)6Sn5 layer could be controlled by Cu diffusion in the Sn(Cu) toward the interface [12,13,14]. Moreover, (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 has been declared as stable compound than Cu6Sn5 which is due to addition of Ni layer on the Cu substrate [12].…”

Section: Top View Examinationmentioning

confidence: 99%

The Effect of Bismuth on Intermetallics Growth between Lead-Free Solders and Electroless Nickel Immersion Silver (ENIMAG) Surface Finish

Zolhafizi

Azlina

2019

KEM

View full text Add to dashboard Cite

Surface finish is coating layer plated on a bare copper board of printed circuit board (PCB). Among PCB surface finishes, Electroless Nickel/Immersion Gold (ENIG) finish is a top choice among electronic packaging manufacturer due to its excellent properties for PCB. However, the use of gold element in ENIG is very high cost and the black pad issue have not been resolved. Thus, by introducing an Electroless Nickel/Immersion Silver (ENImAg) as alternative surface finish hopefully can reduce the cost and offer better properties. The aim of this study is to investigate the effect of bismuth on interfacial reaction during reflow soldering between Sn-2.5Ag (SA25), Sn-3.4Ag-4.8Bi (SAB3448) and ENIMAG surface finish. Solder balls with sizes of 500μm diameters were used. The characteristics of intermetallic compound (IMC) were analyzed by using scanning electron microscopy (SEM), optical microscope and energy dispersive x-ray (EDX). After reflow soldering, the result revealed that only the irregular circle-shape of (Cu,Ni)6Sn5IMC layer was formed at the interface and change to an irregular rod-like shape meanwhile the irregular needle-shape (Ni,Cu)3Sn4was appeared after aging treatment. The result also indicated that, the grain size and thickness of IMC for SAB3448 is smaller and thinner compared to the SA25. The IMC thickness is proportional to the aging duration and IMC morphology for both solder are became thicker, larger and coarser after isothermal aging. No bismuth particle has been detected on SAB3448 solder during top surface examination. In addition, the Bi has been observed can reduce the grain size and the growth rate of IMC. Keywords: ENIMAG, reflow soldering, lead-free solder, intermetallic compound, bismuth

show abstract

Roles of Cu in Pb-free solders jointed with electroless Ni(P) plating

Cited by 26 publications

References 21 publications

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn‐4.0 Ag‐0.5Cu/ENImAg

The effect of cooling rate during multiple reflow soldering on intermetallic layer of Sn‐4.0 Ag‐0.5Cu/ENImAg

Effect of TiO2 nanoparticle addition on electroless Ni–P under bump metallization for lead-free solder interconnection

The Effect of Bismuth on Intermetallics Growth between Lead-Free Solders and Electroless Nickel Immersion Silver (ENIMAG) Surface Finish

Contact Info

Product

Resources

About