Room-Temperature Curing and Grain Growth at High Humidity in Conductive Adhesives with Ultra-Low Silver Content

Pettersen, Sigurd Rolland; Redford, Keith; Njagi, John; Kristiansen, Helge; Helland, Susanne; Kalland, Erik; Goia, Dan V.; Zhang, Zhiliang

doi:10.1007/s11664-017-5376-1

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Room-Temperature Curing and Grain Growth at High Humidity in Conductive Adhesives with Ultra-Low Silver Content

Cited by 3 publications

References 47 publications

Conductive treatment of piezoelectric composite material by low-temperature adhesion comparing with ion sputtering

Conductive treatment of piezoelectric composite material by low-temperature adhesion comparing with ion sputtering

Thermal conduction in novel isotropic conductive adhesive

Electrical and Thermal Conduction of Isotropic Conductive Adhesive based on Novel Conductive Particles

Contact Info

Product

Resources

About