“…Thin film is the most important material form for the fabrication of devices in the contemporary semiconductor industry, which can promote electronic devices toward miniaturization and integration. Numbers techniques have been developed to fabricate BFO thin film in past years, such as pulsed laser deposition (PLD), [ 2,29,36 ] radio‐frequency (RF) magnetron sputtering, [ 4,37,38 ] molecular beam epitaxy (MBE), [ 39,40 ] and metalorganic chemical vapor deposition (MOCVD), [ 41,42 ] as well as sol–gel/chemical‐solution deposition (CSD). [ 3,43,44 ] As shown in Table 1 , [ 2,4,24,29,30,36,38,41,43–61 ] which lists the reported BFO films with their observed polarization ( P )–electric field ( E ) loops, it has been demonstrated that the physical‐based processing, such as PLD or RF, can deposit relatively dense BFO thin films, that show lower leakage and defects.…”