Rotatable magnetron sputtering of aluminium in continuous and high power pulse modes using different strength magnetic arrays

Audronis, M.; Bellido-González, V.; Brown, Robert Michael

doi:10.1016/j.tsf.2011.10.042

Cited by 3 publications

(3 citation statements)

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“…Recently efforts have been made to increase the deposition rates of the HIPIMS process by either adjusting the HIPIMS power input to moderate levels [16][17] , developing a hybrid deposition process [18][19][20] , or varying the magnetic field [16,[21][22] . In the first approach [16][17] , the main differences between the HIPIMS (or HPPMS) and the modulated pulse power (MPP) technique include the magnitude, duration, and shape of the high power pulse.…”

Section: Introductionmentioning

confidence: 99%

“…When the HIPIMS was applied to the Ti target, however, the deposited coating showed a two-phase crystalline structure of cubic TiAlN and hexagonal AlN which exhibited lower hardness of only 18 -19 GPa and substantially higher compressive stress up to 2.7 GPa. Finally, the magnetic field strength has significant influence on the deposition rate of the modulated pulsed power magnetron sputtering [21][22] . Higher ratio of the actual deposition rates of the pulsed power magnetron sputtering to DC magnetron sputtering has been obtained at reduced magnetic field strength, which is strongly material dependent for a range of target materials of copper, aluminium, chromium, titanium and tantalum [21] .…”

Section: Introductionmentioning

confidence: 99%

“…However, the increased deposition rate is accompanied with the decrease in the ionization of metal and gas species which consequently affects the microstructure and mechanical properties of the deposited films. In literature [22] , preliminary results were reported on magnetron sputtering of a Al target in HIPIMS mode using a low A low strength radio frequency (RF) magnetic array. The magnetic field design of the RF magnetic array showed a deposition rate substantially the same as that obtained for the 'standard' strength balanced array and DC power as a result of the increased sputtered flux transport perpendicular to the target surface.…”

Section: Introductionmentioning

confidence: 99%

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Hybrid HIPIMS and DC magnetron sputtering deposition of TiN coatings: Deposition rate, structure and tribological properties

Luo

Yang

Cooke

2013

Surface and Coatings Technology

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Abstract:High power impulse magnetron sputtering (HIPIMS) has the advantage of ultra-dense plasma deposition environment although the resultant deposition rate is significantly low. By using a closed field unbalanced magnetron sputtering system, a hybrid process consisting of one HIPIMS powered magnetron and three DC magnetrons has been introduced in the reactive sputtering deposition of a TiN hard coating on a hardened steel substrate, to investigate the effect of HIPIMS incorporation on the deposition rate and on the microstructure and mechanical and tribological properties of the deposited coating. Various characterizations and tests have been applied in the study, including XRD, FEG-SEM, cross-sectional TEM, Knoop hardness, adhesion tests and unlubricated ball-on-disk tribo-tests. The results revealed that, both the DC magnetron and hybrid-sputtered TiN coatings exhibited dense columnar morphology, a single NaCl-type cubic crystalline phase with strong (220) texture, and good adhesion property. The two coatings showed similar dry sliding friction coefficient of 0.8 -0.9 and comparable wear coefficient in the range of 1 -2 × 10 -15 m 3 N -1 m -1 . The overall deposition rate of the hybrid sputtering, being 0.047 µm/min as measured in this study, was governed predominantly by the three DC magnetrons whereas the HIPIMS only made a marginal contribution. However, the incorporated HIPIMS has been found to lead to remarkable reduction of the compressive residual stress from -6.0 to -3.5 GPa and a slight increase in the coating hardness from 34.8 to 38.0 GPa.

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