2008
DOI: 10.1109/memsys.2008.4443775
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Rubidium vapor cellwith integrated nonmetallic multilayer reflectors

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Cited by 7 publications
(9 citation statements)
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“…Reflector cells were fabricated according to the process described previously in [4]. Briefly, a 1 mm thick <100> silicon wafer is wet through-etched in potassium hydroxide (KOH) with a silicon nitride hardmask with 1.8 mm square lithographically patterned openings.…”
Section: Resultsmentioning
confidence: 99%
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“…Reflector cells were fabricated according to the process described previously in [4]. Briefly, a 1 mm thick <100> silicon wafer is wet through-etched in potassium hydroxide (KOH) with a silicon nitride hardmask with 1.8 mm square lithographically patterned openings.…”
Section: Resultsmentioning
confidence: 99%
“…The design of micromachined cells with integrated Bragg reflectors for rubidium vapor cells has been previously described in [4]. Briefly, the light reflected at the interface between each layer may be made to constructively interfere to maximize the total reflected optical power at a specific wavelength.…”
Section: Reflector Design Bragg Reflectorsmentioning
confidence: 99%
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“…In 2008, Eklund et al utilized 100 µm-thick borosilicate glass wafers at 850 • C to manufacture a spherical glass vapor cell. The wafer-blowing process [45] includes deep reactive ion etching, bonding, blowing, and annealing.…”
Section: Spherical Alkali Vapor Cells Through Wafer Blowingmentioning
confidence: 99%
“…In 2008, a micro-structured dual-focus optics based on micro-Fresnel lens was incorporated into a dual-pass reflective configuration [ 17 ]. In 2009, Bragg reflectors, composed of layers of amorphous silicon, silicon dioxide (SiO 2 ), and silicon nitride (Si 3 N 4 ) were integrated, which improved the reflectance of angled sidewalls by nearly three times (as compared to that of uncoated silicon), resulting in an eight-times increase of the return reflection efficiency [ 18 ]. The variation in the dielectric thin film thickness due to the arrival angles of plasma enhanced chemical vapor deposition (PECVD) was optimized by the deposition rate [ 19 , 20 , 21 ].…”
Section: Introductionmentioning
confidence: 99%