“…In contrast, hybrid foams can maximize the thermal flux of materials by coupling 3D interlinked networks with thermal conduction, which greatly improves the heat dissipation of integrated circuits and heat exchangers. 22 Besides, the hybrid foams are also qualified as an EMW absorbing/shielding material to eliminate EMI in electron devices due to their large interface polarization, abundant air-filled pores, and low dielectric constants. To date, various synthetic strategies have been developed to prepare metallic/nonmetallic hybrid foams, including templating, 23 sol-gel assembly, 24 nanosmelting, 25,26 and combustion synthesis.…”