2013
DOI: 10.1039/c3tc30585f
|View full text |Cite
|
Sign up to set email alerts
|

Sb-based semiconductors for low power electronics

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
11
0
1

Year Published

2016
2016
2021
2021

Publication Types

Select...
6
1

Relationship

0
7

Authors

Journals

citations
Cited by 25 publications
(12 citation statements)
references
References 86 publications
0
11
0
1
Order By: Relevance
“…In x Ga 1−x Sb晶体可以通过改变In含量进行光电性 能调控, 其晶格常数和吸收波长在6.4794-6.0959 Å和 1.7-6.8 μm范围内控制, 可以制备成高性能的红外探 测器、传感器以及热光伏电池等 [1][2][3] . In的加入不仅可 以调控In x Ga 1−x Sb晶体的带隙, 而且会占据GaSb晶格 结构中的Ga空位(V Ga ), 从而减少其空位缺陷 [4] .…”
Section: 引言unclassified
“…In x Ga 1−x Sb晶体可以通过改变In含量进行光电性 能调控, 其晶格常数和吸收波长在6.4794-6.0959 Å和 1.7-6.8 μm范围内控制, 可以制备成高性能的红外探 测器、传感器以及热光伏电池等 [1][2][3] . In的加入不仅可 以调控In x Ga 1−x Sb晶体的带隙, 而且会占据GaSb晶格 结构中的Ga空位(V Ga ), 从而减少其空位缺陷 [4] .…”
Section: 引言unclassified
“…4,5 For the p-channel FET, strain-engineered channels with high-Ge-content SiGe and pure Ge are attractive candidates due to the high hole mobilities which can be achieved. 6 Other attractive p-channel candidates for III-V CMOS are strained antimonides, 7,8 which have also been shown to exhibit high hole mobilities. [9][10][11][12][13][14][15] The unstrained hole mobilities of III-V compounds are generally low, so researchers have exploited quantum confinement and strain as a means of splitting the heavy-hole and light-hole valence bands, giving lower in-plane hole masses and enhanced low-field mobility.…”
Section: Introductionmentioning
confidence: 99%
“…28 The layer-layer coupling capability is relevant for the development of the CMOS technology, based on the integration between III-V compounds and Si. 29 In addition, the GaSb compound is an attractive material for this kind of integration technology, [30][31][32][33] and electronic effects such as band-to-band tunneling, 33 ferroelectric properties, 34 and biocompatibility studies 35 that can be efficiently used in FET, based on integration technology and sensor designs.…”
Section: Introductionmentioning
confidence: 99%