Scalable Fiber-Array-to-Chip Interconnections with Sub-Micron Alignment Accuracy

Yu, Sheng‐Tao; Gaylord, Thomas K.; Bakir, Muhannad S.

doi:10.1109/ectc51909.2023.00130

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 2023

DOI: 10.1109/ectc51909.2023.00130

|View full text |Cite

Scalable Fiber-Array-to-Chip Interconnections with Sub-Micron Alignment Accuracy

Sheng‐Tao Yu

Thomas K. Gaylord

Muhannad S. Bakir

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

Supporting

Mentioning

Contrasting

Year Published

2024

Publication Types

Select...

Article1

Relationship

Self Cite0

Independent1

Authors

Journals

Cited by 1 publication

References 9 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

Highly efficient fiber to Si waveguide free-form coupler for foundry-scale silicon photonics

Ranno,

Sia,

Popescu

et al. 2024

Photon. Res.

View full text Add to dashboard Cite

As silicon photonics transitions from research to commercial deployment, packaging solutions that efficiently couple light into highly compact and functional sub-micrometer silicon waveguides are imperative but remain challenging. The 220 nm silicon-on-insulator (SOI) platform, poised to enable large-scale integration, is the most widely adopted by foundries, resulting in established fabrication processes and extensive photonic component libraries. The development of a highly efficient, scalable, and broadband coupling scheme for this platform is therefore of paramount importance. Leveraging two-photon polymerization (TPP) and a deterministic free-form micro-optics design methodology based on the Fermat’s principle, this work demonstrates an ultra-efficient and broadband 3-D coupler interface between standard SMF-28 single-mode fibers and silicon waveguides on the 220 nm SOI platform. The coupler achieves a low coupling loss of 0.8 dB for the fundamental TE mode, along with 1 dB bandwidth exceeding 180 nm. The broadband operation enables diverse bandwidth-driven applications ranging from communications to spectroscopy. Furthermore, the 3-D free-form coupler also enables large tolerance to fiber misalignments and manufacturing variability, thereby relaxing packaging requirements toward cost reduction capitalizing on standard electronic packaging process flows.

show abstract

Highly efficient fiber to Si waveguide free-form coupler for foundry-scale silicon photonics

Ranno,

Sia,

Popescu

et al. 2024

Photon. Res.

View full text Add to dashboard Cite

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Scalable Fiber-Array-to-Chip Interconnections with Sub-Micron Alignment Accuracy

Cited by 1 publication

References 9 publications

Highly efficient fiber to Si waveguide free-form coupler for foundry-scale silicon photonics

Highly efficient fiber to Si waveguide free-form coupler for foundry-scale silicon photonics

Contact Info

Product

Resources

About