2023
DOI: 10.1021/acsami.2c23279
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Scalable Interlayer Nanostructure Design for High-Rate (10C) Submicron Silicon-Film Electrode by Incorporating Silver Nanoparticles

Abstract: High C-rate capability at 10C is a key performance indicator for the commercialization of the next-generation high-charging lithium microbattery. However, silicon (Si) anode satisfying the prerequisite high specific capacity suffers from poor electron/ionic conductivity, seriously limiting the 10C rate capability. Accordingly, we propose the strategy of inserting highly conductive silver nanoparticles (AgNPs) as an interlayer between two RF-sputtered amorphous Si thin films to form an Si/Ag/Si multilayered ano… Show more

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Cited by 7 publications
(2 citation statements)
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“…During the first discharge, the cathodic peak appears near 0.25 V is attributed to the irreversible lithiation of the Si–O surface layer, , and the peaks disappear in the following cycles. The cathodic peak around 0.01 and 0.17 V corresponds to Li + embedding into Si to form the Li–Si alloy, while the two anodic peaks at 0.30 and 0.48 V are due to the Li + extraction forming Li x Si alloy. In the subsequent cycles, the broad and weak cathodic peak at around 0.60 V could be ascribed to the formation of a solid electrolyte interface (SEI) of the electrolyte decomposition.…”
Section: Resultsmentioning
confidence: 99%
“…During the first discharge, the cathodic peak appears near 0.25 V is attributed to the irreversible lithiation of the Si–O surface layer, , and the peaks disappear in the following cycles. The cathodic peak around 0.01 and 0.17 V corresponds to Li + embedding into Si to form the Li–Si alloy, while the two anodic peaks at 0.30 and 0.48 V are due to the Li + extraction forming Li x Si alloy. In the subsequent cycles, the broad and weak cathodic peak at around 0.60 V could be ascribed to the formation of a solid electrolyte interface (SEI) of the electrolyte decomposition.…”
Section: Resultsmentioning
confidence: 99%
“…A Si thin film of 300 nm in thickness was deposited on all the samples with different patterns to form a patterned-Si thin film by RF magnetron sputtering, under the same sputtering conditions as those in our previous work. 48 Before the coin cell assembly, all the Cu microgrids were removed. The process flowchart is shown in Fig.…”
Section: Methodsmentioning
confidence: 99%