2016 IEEE 66th Electronic Components and Technology Conference (ECTC) 2016
DOI: 10.1109/ectc.2016.86
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Scalable Modeling and Measurement of TSV Applied for Efficiency Improvement of a RF PA

Ming-Fong Jhong
1
,
Ching-Yen Ho
2
,
Po-Chih Pan
3
et al.
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