2008 IEEE International Electron Devices Meeting 2008
DOI: 10.1109/iedm.2008.4796827
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Scaling trends for random telegraph noise in deca-nanometer Flash memories

Abstract: We present a thorough investigation of the random telegraph noise scaling trend for both NAND and NOR floating-gate Flash memories, including experimental and physics-based modeling results. The statistical distribution of the random telegraph noise amplitude is computed using conventional 3D TCAD simulations, establishing a direct connection with cell parameters. The analysis results in a simple formula for the random telegraph noise amplitude standard deviation as a function of cell width, length, substrate … Show more

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Cited by 74 publications
(47 citation statements)
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“…However, similar to FG flash, CTF memories also suffer from reliability issues associated with trap generation in the gate stack during program/erase (P/E) cycling, e.g., reduction in memory window (MW), stress-induced leakage current (SILC)-assisted charge loss, and random telegraph noise [8]- [10]. These issues are further aggravated for multiple-level cell (MLC) operation due to higher P/E biases and also as the distinction between different threshold voltage (V T ) levels becomes finer [11]- [13].…”
mentioning
confidence: 99%
“…However, similar to FG flash, CTF memories also suffer from reliability issues associated with trap generation in the gate stack during program/erase (P/E) cycling, e.g., reduction in memory window (MW), stress-induced leakage current (SILC)-assisted charge loss, and random telegraph noise [8]- [10]. These issues are further aggravated for multiple-level cell (MLC) operation due to higher P/E biases and also as the distinction between different threshold voltage (V T ) levels becomes finer [11]- [13].…”
mentioning
confidence: 99%
“…4). This parameter depends on dopant carrier concentration, oxide thickness, cell dimensions and STI edge roughness, which could increase threshold voltage fluctuations [19]. RTN impact on device is taken into account as an extra margin in threshold voltage spread.…”
Section: ''Intrinsic'' Failure Mechanisms Corrected By Algorithmmentioning
confidence: 99%
“…RTN-induced I d variation can be up to 40% in 30×30nm devices [2], and the V th variation can be larger than 70mV for the smallest devices at 22nm technology node [3]. The RTN effect increases superlinearly with the scaling down of the device's size [4]. RTN is also a serious concern in CMOS logic circuits [5].…”
Section: Introductionmentioning
confidence: 99%