Scanning electrochemical microscopy to study the effect of crystallographic orientation on the electrochemical activity of pure copper

Martinez-Lombardia, E.; González-García, Yaiza; Lapeire, Linsey; Graeve, Iris De; Verbeken, Kim; Kestens, Léo; Mol, J.M.C.; Terryn, Herman

doi:10.1016/j.electacta.2013.11.048

Cited by 94 publications

(62 citation statements)

References 37 publications

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“…Several studies have shown that a higher tunneling current will flow in the case of a thinner and/or a more defective oxide film than in the case of a thicker and/or a less defective oxide film. 10,[21][22][23] In the image, the passive film on the stainless steel can be distinguished from the insulating epoxy resin by a bright circle surrounded by four dark corners of the edge. The striped pattern and dispersed black spots in the image are considered to be the result of a tip movement artifact and residual abrasive particles, respectively.…”

Section: Estimation Of Ph and [Hs -] During Lpig Operation-mentioning

confidence: 99%

Effect of Hydrogen Sulfide Ions on the Passive Behavior of Type 316L Stainless Steel

Lee

Kitagawa

Nakanishi

et al. 2015

J. Electrochem. Soc.

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The effect of hydrogen sulfide ions (HS − ) on the passivity of type 316L stainless steel was investigated in pH 8.4 boric acid-borate buffer solution. Galvanostatic polarization of a silver microelectrode covered with Ag 2 S generated both OH − and HS − above the stainless steel surface. During potentiostatic polarization of the stainless steel, the passivity-maintaining current density increased with increase in the concentration of HS − in the vicinity of the surface. The impedance of the stainless steel at a constant frequency decreased during polarization in the presence of HS − , while it was sustained after dilution of HS − . Electrochemical impedance spectroscopy (EIS), Mott-Schottky (M-S) analysis and scanning electrochemical microscopy (SECM) showed that a defective and n-type semiconductive passive film was formed in the solution containing HS − . Auger electron spectroscopy (AES) revealed that metal cations and oxygen vacancies in the passive film on the stainless steel increased when it was formed in a HS − -containing solution. The series of changes in passive film properties is thought to be due to adsorption of HS -on the film surface during the polarization. Corrosion resistance of stainless steel is thought to be dependent on degradation of the passive film, which is important to understand a precursor process involved in localized corrosion such as pitting corrosion and to estimate the long-term performance of the material. Inclusions of sulfides such as manganese sulfide (MnS) are known to provide pitting corrosion sites of stainless steel. [1][2][3] As for the roles of MnS in pitting corrosion, it has been generally agreed that electrochemical and/or chemical reactions of MnS release S species (SO 4 2-, HSO 3 -, S 2 O 3 2-, S and S 2-). The released S species change the composition of the local solution contiguous to the inclusion and lead to a decrease of pH near the micro-area. The decrease in pH and the presence of aggressive S species result in transition of the passive surface to a transpassive state, causing exposure of the substrate to the solution, which is the initiation of pitting corrosion.1-5 Eklund suggested that the dissolution of MnS gives rise to acidification of the solution by producing sulfate ions:Solution acidification is also caused by production of thiosulfate ions:In both cases, elemental sulfur is finally formed. On the other hand, Wraglén proposed that elemental sulfur formed by MnS dissolution leads to further acidification as follows: Many possible explanations for the detrimental effects of various S species causing initiation and/or propagation of pitting corrosion on stainless steel have been presented. Most previous studies have focused on the overall processes, including destabilization of the passive film, removal of the film, and initiation and/or propagation of pits. Since degradation of the passive film is the initial process of pitting corrosion, it is important to contemplate the change in passivity or passive film until depassivation. When stainless st...

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Section: Estimation Of Ph and [Hs -] During Lpig Operation-mentioning

confidence: 99%

Effect of Hydrogen Sulfide Ions on the Passive Behavior of Type 316L Stainless Steel

Lee

Kitagawa

Nakanishi

et al. 2015

J. Electrochem. Soc.

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“…18 Meanwhile, reaction (2) takes place at the surface of the oxide layer. Owing to the higher defect density of an oxide layer on a Cu(001) surface, 19 it shows higher corrosion activity than Cu(111) and Cu(110) surfaces in 10 μM NaCl solution. Thus, the observed dierence in the dissolution rate originates from the crystallographic orientation of the grains constituting the Cu wires.…”

Section: Corrosion Of Cu Ne Wiresmentioning

confidence: 99%

“…18,19 Under such a condition, structural changes at a surface appear only when the accumulated stress caused by corrosion reaches a certain level. Thus, real-time changes in corrosion sites are not necessarily able to be visualized by AFM or STM.…”

mentioning

confidence: 99%

Visualizing Nanoscale Distribution of Corrosion Cells by Open-Loop Electric Potential Microscopy

et al. 2016

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)>IJH=?J Corrosion is a traditional problem but still one of the most serious problems in industry. To reduce the huge economic loss caused by corrosion, tremendous eort has been made to understand, predict and prevent it. Corrosion phenomena are generally explained by the formation of corrosion cells at a metalelectrolyte interface. However, experimental verication of their nanoscale distribution has been a major challenge *

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“…Further, it is important to comment that it is proven that certain crystallographic orientations and grain boundaries have the potential to make a microstructure more resistant against corrosion , but the thermomechanical treatments that would be necessary in order to produce a corrosion resistant microstructure will affect many different parameters at the microscopic level and this will alter the final response of the material. Hence, metal engineering for corrosion protection purposes has still a long way to go before being a tool for industry.…”

Section: Discussionmentioning

confidence: 99%

“…As an example, some studies considered grain size effects when interpreting corrosion; many of them suggested that as grain size decreases, corrosion rate decreases but the contrary has also been observed . The grain‐dependent anodic dissolution and the influence of the crystallographic orientation on the barrier properties of the passive oxide of pure copper have also been investigated .…”

Section: Introductionmentioning

confidence: 99%

Study of the influence of the microstructure on the corrosion properties of pure copper

Martinez-Lombardia

Lapeire

Graeve

et al. 2015

Materials & Corrosion

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Different thermomechanical processes have been used to modify the microstructure of elelctrolytic tough pitch copper (ETP-Cu) in terms of texture, mean grain and grain boundary length fraction. Electron backscatter diffraction (EBSD) and linear sweep voltammetry measurements were performed to study the relation between the macroscopic electrochemical behaviour and the microstructure. FE-SEM was used to visualise the surface after the potentiodynamic scans. The results indicate that there is only a small influence of the microstructure on the global electrochemical response of pure copper. The previously reported influence of the crystallographic orientation and grain boundary characteristics on the local corrosion behaviour of pure copper are not clearly reflected in the macroscopic electrochemical response

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Scanning electrochemical microscopy to study the effect of crystallographic orientation on the electrochemical activity of pure copper

Cited by 94 publications

References 37 publications

Effect of Hydrogen Sulfide Ions on the Passive Behavior of Type 316L Stainless Steel

Effect of Hydrogen Sulfide Ions on the Passive Behavior of Type 316L Stainless Steel

Visualizing Nanoscale Distribution of Corrosion Cells by Open-Loop Electric Potential Microscopy

Study of the influence of the microstructure on the corrosion properties of pure copper

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