1995
DOI: 10.1557/proc-406-425
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Scanning Electron Microscopy (Sem), Transmission Electron Microscopy (Tem) and Secondary Ion Mass Spectroscopy (Sims) Characterization of the Morphology of Aluminum Bond Pads for Surface Reflectivity Applications.

Abstract: Extreme variations in surface reflectivity/topography have been observed on silicon wafers with evaporated aluminum metallization following thermal annealing processes. Such topographic variations negatively impacted the performance of wire bonder pattern recognition systems. It was proposed that this variation was attributed to differences in deposition rates during evaporation of the aluminum front metallization. SEM analysis revealed that the topographically rough sites, deemed as normal for this processing… Show more

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