2017
DOI: 10.1016/j.jmapro.2017.09.003
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Sculpturing of single crystal silicon microstructures by elliptical vibration cutting

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Cited by 92 publications
(18 citation statements)
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“…The periodic boundary condition is applied along the y direction to mimic bulk silicon. The nominal cutting direction, tool rake/clearance angle, and phase difference were determined referring to the experimental setup [42]. The vibration amplitude and ( 4) nominal DOC are enlarged to approach the experimental scale with acceptable simulation cost.…”
Section: Details Of the Cutting Modelmentioning
confidence: 99%
See 1 more Smart Citation
“…The periodic boundary condition is applied along the y direction to mimic bulk silicon. The nominal cutting direction, tool rake/clearance angle, and phase difference were determined referring to the experimental setup [42]. The vibration amplitude and ( 4) nominal DOC are enlarged to approach the experimental scale with acceptable simulation cost.…”
Section: Details Of the Cutting Modelmentioning
confidence: 99%
“…At 300 K, obvious crack and fracture can be observed in workpiece during the tool upward movement. For brittle material like single-crystal silicon, the tool upward movement would lead to tearing off of materials and leave defects in the workpiece, which is considered as a specific problem in EVC [42]. Although these cracks can be removed by further vibration cycles, the machining stability will be impacted due to the irregularity of workpiece surface.…”
Section: Cutting Performancementioning
confidence: 99%
“…Furthermore, thermal diffusion between the diamond cutting tool and the steel workpiece is significantly suppressed to prevent tool wear. At the same time, by precisely controlling the vibration amplitude in depth of cutting direction, the envelope of cutting edge trajectory can be precisely transferred into the machined surface, which leads to the successful fabrication of micro/nanostructures . It should be mentioned that the curvature radius of the vibration locus is smaller than the minimum curvature radius of the target structures to avoid undesirable over‐cutting.…”
Section: Methodsmentioning
confidence: 99%
“…Ultimate surface finish with high surface integrity, low surface roughness, and high form accuracy is crucial for achieving superior optical, electrical, and chemical corrosion resistance properties of advanced components and parts [1][2][3][4]. Among different types of micro/nano-manufacturing techniques, mechanical machining such as ultra-precision single-point diamond turning (SPDT) with ultra-fine material removal has been demonstrated as a promising technique for achieving ultra-smooth surface of a variety of materials, such as metals [5][6][7][8], semiconductor materials [9][10][11], and ceramics [12][13][14][15][16]. Specifically, in addition to utilized precision CNC lathes and ultra-sharp diamond tools, SPDT is also highly dependent on the properties of workpiece materials, primarily due to the comparable feature size of internal microstructures of workpiece materials with depth of cut (DOC), as well as cutting edge radius of diamond tools.…”
Section: Introductionmentioning
confidence: 99%