2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2017
DOI: 10.1109/ipfa.2017.8060161
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SDL analysis in temperature sensitive failure based on DALS system

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Cited by 4 publications
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“…It relies on changes in behavior (e.g., pass-to-fail or fail-to-pass) in reaction to laser heating to identify the location of the suspected fault. DALS is one of the commonly used SDL implementations [8][9][10][11].…”
Section: Introductionmentioning
confidence: 99%
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“…It relies on changes in behavior (e.g., pass-to-fail or fail-to-pass) in reaction to laser heating to identify the location of the suspected fault. DALS is one of the commonly used SDL implementations [8][9][10][11].…”
Section: Introductionmentioning
confidence: 99%
“…There are many literatures that discuss this technique and its different applications [2][3][4][5][6][7]. Dynamic Analysis by Laser Stimulation (DALS) is one of the known SDL implementations [8][9][10][11]. However, there are cases where the failure is occurring at a temperature where the laser alone is not sufficient to effectively induce a change of device behavior.…”
mentioning
confidence: 99%