2019
DOI: 10.1016/j.apsusc.2019.04.078
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Secondary particle properties for the ion beam sputtering of TiO2 in a reactive oxygen atmosphere

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Cited by 10 publications
(6 citation statements)
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“…The highenergy shoulder extends to higher energies with an increasing emission angle, i.e., a decreasing scattering angle, and with an increasing ion energy. As already discussed in detail in earlier works, 7,8 these high-energy shoulders can be related to directly backscattered and directly sputtered O + ions. Similar to the observations made for The energy distributions as shown in Fig.…”
Section: E Energy Distribution Of Secondary Tio Ionsmentioning
confidence: 53%
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“…The highenergy shoulder extends to higher energies with an increasing emission angle, i.e., a decreasing scattering angle, and with an increasing ion energy. As already discussed in detail in earlier works, 7,8 these high-energy shoulders can be related to directly backscattered and directly sputtered O + ions. Similar to the observations made for The energy distributions as shown in Fig.…”
Section: E Energy Distribution Of Secondary Tio Ionsmentioning
confidence: 53%
“…The observed dependence of the maximum sputtering yield on the ion energy and ion incidence angle is in good agreement with sputtering laws mentioned in the literature. 13 The differential sputtering yield is fitted by a superposition of two cosine functions, as already proposed in earlier studies, 7,8,30…”
Section: Angular Distribution Of Sputtered Ti Particlesmentioning
confidence: 99%
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“…Deshalb wurden am Leibniz-Institut für Oberflächenmodifizierung e.V. (IOM) in den vergangenen Jahren umfangreiche, systematische Untersuchungen zum Ionenstrahlzerstäuben an verschiedenen Materialsystemen durchgeführt: Ag (Metall, [7,8]), Ge (Halbleiter, [9,10]), TiO 2 (Dielektrikum, [11,[13][14][15][16]) oder SiO 2 (Dielektrikum, [17,18]…”
Section: Ion Beam Sputter Deposition -Fundamentals and Application Founclassified
“…IBSD is distinguished by the highest energies of forming particles. as well as a large number of parameters affecting the deposition process and the possibility of achieving a higher vacuum in the operating mode [27][28][29][30][31][32][33][34]. This allows fine varying of the electrically conductive, structural, optical, mechanical, and other properties of the films during deposition, and to deposit more uniform layers in thickness and composition over large areas of the substrates.…”
Section: Introductionmentioning
confidence: 99%