Selection of Appopriate Thermal Model For Printed Circut Boards in CFD Analysis

Shankaran, Gokul; Singh, Rahul Kumar

doi:10.1109/itherm.2006.1645348

Cited by 4 publications

(2 citation statements)

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“…The simplest PCB model, often called lumped (compact) PCB model, applies a uniform bidirectional (in-plane and out-of-plane) conductivity throughout the PCB [16], [17]. Another common practice is to use the layerwise lumped PCB model [17], wherein different isotropic conductivity values are applied to the bulk of the PCB and the individual trace layers. These approaches, though simple and reasonable as long as the trace distribution is more or less uniform in any given layer, often lead to relatively large errors in temperature prediction.…”

Section: Introductionmentioning

confidence: 99%

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Spatial Variation of Temperature on Printed Circuit Boards: Effects of Anisotropic Thermal Conductivity and Joule Heating

Doğruöz¹,

Shankaran

2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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A printed circuit board (PCB) consists of multiple layers of dielectric material and current-carrying metal traces and vias. Performing system-level simulations of PCBs with detailed trace and via geometries is very costly, the present approach considers the effects of the trace and via geometry in the physical model by importing Electronic Computer Aided Design (ECAD) data comprising the trace and via layout of the board and determines spatially varying orthotropic conductivity (k x , k y , and k z ) on the PCB based on the ECAD data. In addition, the present approach considers the effects of joule heating in the current-carrying traces by utilizing multiple 2-D sources where the powermap is determined by solving the governing dc electric field equations on the trace. In this paper, the effects of both the trace layer orthotropic thermal conductivity and joule heating are studied on a sample PCB. Comparisons are made with earlier studies and conventional models when possible. It is shown that the location of the hot spots and temperature values differ substantially if different methods are used.

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Section: Introductionmentioning

confidence: 99%

“…These approaches, though simple and reasonable as long as the trace distribution is more or less uniform in any given layer, often lead to relatively large errors in temperature prediction. Details of these PCB models are discussed elsewhere [16], [17].…”

Section: Introductionmentioning

confidence: 99%