Atomic layer deposition (ALD) [1,2] is an excellent tool for atomic-level materials engineering. In ALD, a thin film is grown in a self-limiting manner through surface reactions between alternately supplied gaseous precursors. The ALD technique enables variation of the film composition with atomic-layer accuracy. However, this accuracy is only limited naturally in the growth direction, i.e., perpendicular to the substrate surface. With selective-area ALD, the film growth could also be controlled on the surface, i.e., the film would be deposited only where needed, thereby allowing the preparation of 3D nano-and microstructures. Selective-area ALD can be attempted with patterned self-assembled monolayers (SAMs) that form spontaneously from liquid or gas phases. [3,4] The function of the SAM is to passivate the surface and thereby prevent the growth of a thin film. Previously, SAMs have been studied mostly for selective-area ALD of oxides. [5,6] Selective-area ALD of ruthenium [7] has also been reported. Noble metals are particularly important for selective-area ALD. Because noble metals are difficult to etch, selective-area ALD would enable the preparation of 3D structures that are otherwise difficult to prepare. Selective-area ALD requires high-quality SAMs patterned in a controlled manner. Patterning can be performed by various methods, e.g., by destroying the monolayer through a mask with energetic beams such as ions, electrons, and protons.[8] Scanning-probe-based lithography techniques, such as atomic force microscopy (AFM) and scanning tunneling microscopy (STM), also destroy the monolayer, and the patterning resolution can approach the molecular scale.[8] Patterning with soft lithography, e.g., microcontact printing, [7,9,10] is a fast way to form a patterned SAM all at once. In this report, we will demonstrate a preparation method for a passivating and patterned octadecyltrimethoxysilane (CH 3 (CH 2 ) 17 Si(OCH 3 ) 3 , ODS) SAM for prevention of the iridium ALD process at 225°C with Ir(acac) 3 and O 2 as precursors. SAMs were patterned using a lift-off process [11] with aluminum as a mask layer: first, aluminum was evaporated through a shadow mask, then an ODS SAM was formed from the gas phase, and finally aluminum was removed by etching. With this method micrometer-scale patterns were achieved. The method was chosen because of its simplicity, which allowed us to concentrate on studying the optimum deposition of SAMs for complete passivation of the surface. To our knowledge this is the first time that iridium has been grown by selective-area ALD using a patterned SAM.Successful selective-area ALD requires complete passivation which, in turn, requires SAMs to have complete coverage with no defects that could serve as nucleation sites. Therefore, two methods for preparing SAMs from the gas phase were compared -preparation either with alternate water exposure or without it. In the normal process, the substrate is exposed only to ODS vapor. In the alternative process, water-vapor pulses were given alternately w...