Selective Metallization of Mg/NH3-Treated Teflon by Copper CVD

Abstract

The surface of Teflon, which can be made hydrophilic by a chemical treatment in a solution of solvated electrons in the presence of magnesium, can be restored by UV photochemical oxidation under oxygen. The Mg/NH 3 -treated Teflon surfaces are easily metallized in a single-step process by copper CVD when (VTMS)Cu(hfac) or (MHY)Cu(hfac) are used as precursors (where VTMS = vinyltrimethylsilane, hfac = hexafluoroacetylacetonate, and MHY = 2-methyl-1-hexene-3-yne). The growth rate of the copper film (thickness 200±500 nm) is between 30 and 50 nm min ±1 , depending upon the precursor used. The Cu films, with a resistivity of 1.9 ± 0.2 mW cm, are pure, as determined by X-ray photoelectron spectroscopy (XPS). Patterned UV irradiation of the treated Teflon results in an identical pattern of copper after CVD, and hence selective copper deposition can be achieved on Teflon.

Current Trends in Patterning with Copper

“…Laser-assisted CVD like conventional CVD relies on a volatile Cu precursor being delivered to the substrate in the gas phase. , Selective Cu deposition is achieved by heating the areas where Cu deposition is required with a laser, using the apparatus illustrated in Figure . This induces pyrolysis of the precursor and subsequent Cu film deposition .…”

Stability of fluorinated parylenes to oxygen reactive-ion etching under aluminum, aluminum oxide, and tantalum nitride overlayers

“…Surface modification has been achieved by low-energy ion beams; 2,3 argon plasma; 4 water-vapor plasma; 5 remote-hydrogen plasma; 6,7 oxygen plasma; 8 filament-assisted watervapor modification; 9,10 strong bases, such as KOH and LiOH; 11,12 solution-borne reducing agents, such as benzoin dianion/DMSO and NaBH 4 ; 13,14 and solvated electrons. 15,16 Further, a book and a review article discuss the surface modification of polymeric surfaces via plasmas. 17,18 However, it is the particular interest here to study how fluorocarbons interact with oxidizing plasmas.…”

Porous core photonic crystal fibre with metal‐coated central hole for terahertz applications

“…In this regard, Sazio et al [30] reported a deposition mechanism of metal or semiconductor around a central hole of diameter 1.0 µm that can be narrowed by a factor of 100 down to 25 nm or smaller. Moreover, the Teflon can be coated with copper using chemical vapour deposition [31] or metal-coated hollow waveguide technology [32]. Furthermore, the standard fabrication technology could produce a PCF with low roughness and little radiation losses.…”