Selective Plating on Photopatterned Titanium Oxide Films

Cordonier, Christopher E. J.; Endo, Hitoshi; Kagami, Takahiro; Okabe, Yohei; Ide, Mieko; Suzuki, Shion; Honma, Hideo

doi:10.1149/2.012401jes

Cited by 18 publications

(16 citation statements)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[20][21][22] Despite satisfactory adhesion results for the thin films (<1 μm), when films had been thickened the adhesion failed. 23 Therefore to determine the actual adhesion strength, evaluation of thickened films (>5 μm) was necessary.…”

Section: Resultsmentioning

confidence: 99%

“…[15][16] Furthermore, employment of expensive palladium catalyst also introduces the need for a palladium removal procedure in order to prevent migration and short circuits that lead to poor device reliability. [17][18][19] Solution processed adhesion layers for direct electroless plating on glass have been demonstrated where a few tens of nanometer thick Pd-NiO, 20 Pd grafted TiO 2 , 21 or Pd-SnO 2 22 films served as catalytic anchor layers. Based on those results, the method outlined in Figure 1 for direct electroless copper plating on the substrate was investigated, where the catalytic anchor layer consisting of copper and titanium oxides was formed by pyrolysis of a metal complex film containing copper and titanium.…”

mentioning

confidence: 99%

See 1 more Smart Citation

Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer

Okabe

Kagami

Horiuchi

et al. 2016

J. Electrochem. Soc.

Self Cite

View full text Add to dashboard Cite

A method for copper deposition on glass and ceramics was investigated by direct plating on 20-30 nm thick copper inclusive titanium oxide films formed on the substrate surface. The copper inclusive titanium oxide film functioned as an adhesion layer and as a catalyst for autocatalytic copper deposition. Copper inclusive titanium oxide films were formed by pyrolysis of solution deposited 1-hydroxy phenyl ketone titanium-copper complex films. After deposition of electroless copper seed layers, 15-20 μm thick electrolytic copper films were formed, where upon thermal treatment up to 0.5 kN/m adhesion strength was attained on borosilicate glass. This process enabled electroless copper plating without the use of palladium as a catalyst on non-roughened smooth glass or ceramic substrate surfaces. The copper-titanium oxide adhesion layers were characterized and cross-sectional transmission electron microscopy illustrated the adhesion mechanism and catalyst structure. Despite poor thermal conductivity, due to properties such as transparency, smooth surface, chemical and thermal stability, coefficient of thermal resistance, dielectric constant, electrical insulation and physical strength, glass has gained attention an electronic substrate material.1-3 Two examples are in 2.5 D/3 D electronic device and RF module packaging. [4][5][6][7] In addition to these properties, abundance and availability in a wide range of shape and size make glass an attractive economic substitute for silicon in interposers. [4][5][6][7] Development of through substrate interconnect via hole formation technology for glass has progressed however, metallization technology relies on vacuum deposition, the silver mirror reaction or surface roughening followed by electroless plating for conductive seed layer formation. [8][9][10][11] Using sputtered Cu, Ti/Cu or Cr base layers, relatively high adhesion strength has been attained.12-14 However, dry processes have productivity limiting disadvantages such as size restriction, need for expensive equipment and high running cost. Therefore, economic wet methods have been studied as an alternative. In direct electroless plating methods, adhesion between the glass and the plated films has been accomplished by etching the glass surface with hydrofluoric acid, but with the sacrifice of its original transparency and smoothness. [15][16] Furthermore, employment of expensive palladium catalyst also introduces the need for a palladium removal procedure in order to prevent migration and short circuits that lead to poor device reliability. [17][18][19] Solution processed adhesion layers for direct electroless plating on glass have been demonstrated where a few tens of nanometer thick Pd-NiO, 20 Pd grafted TiO 2 , 21 or Pd-SnO 2 22 films served as catalytic anchor layers. Based on those results, the method outlined in Figure 1 for direct electroless copper plating on the substrate was investigated, where the catalytic anchor layer consisting of copper and titanium oxides was formed by pyrolysis of a metal complex film ...

show abstract

Section: Resultsmentioning

confidence: 99%

mentioning

confidence: 99%

Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer

Okabe

Kagami

Horiuchi

et al. 2016

J. Electrochem. Soc.

Self Cite

View full text Add to dashboard Cite

show abstract

“…Redistribution subject to ECS terms of use (see 54.245.55.244 Downloaded on 2018-05-12 to IP also be suitable for the selective gold plating of titanium oxide films on glass reported for an analogous cysteamine-gold plating system. 25 …”

Section: Discussionmentioning

confidence: 99%

Direct Gold Plating Selectively on UV Modified Polymer Film Using Tiopronin-Gold

Endo

Tashiro

et al. 2015

J. Electrochem. Soc.

Self Cite

View full text Add to dashboard Cite

An economic and low toxicity gold plating process for bio-compatible device fabrication was investigated. A tiopronin-gold complex altered by mercaptothiodiazole or mercaptotriazole derivatives gave a form of the complex that could be reduced autocatalytically to enable electroless gold plating. Catalytic ca. 5 nm gold particles were selectively grafted into cycloolefin polymer and polyethylenenaphthalate film surfaces by adsorption of tiopronin-gold complex from solution into 20-30 nm deep ultra-violet light modified surface layers followed by reduction with sodium borohydride. Exposure of the catalyst adsorbed surfaces to baths composed of tiopronin-gold complex, mercaptothiodiazole and ascorbic acid resulted in selective electroless plating on the modified surfaces. Observation of the interface cross-section by transmission electron microscopy revealed that the gold deposits were physically anchored to the substrate by nanometer scale octopus trap like structures. Bio-compatible electronics for in vivo application represent an innovative field of medicine, offering ailment for life quality debilitating health complications. In the applications, sensors and transducers read or relay electronic input or output directly to or from living biological systems, like the brain. In retinal and cochlear neuroprosthesis, neural array implants facilitate direct stimulation of optic nerves with signals from a miniature camera, or direct stimulation of cochlear nerves with signals from a microphone. Research involving conscious neural control to operate external devices like prosthetic robots has also been undertaken. Neural electrode arrays also serve in therapeutic stimulation, bypass or diagnosis of specific neural systems in stroke and head injury patients and in patients suffering from Parkinson's disease, epilepsy, dystonia and severe clinical depression.1-10 Another important application for in vivo electronics is sensors and MEMS on catheters, allowing sensory feedback to the operator or manipulation of a MEMS device internally.11,12 Micro in vivo electronic sensors also offer a means of less invasive direct monitoring by wireless transmission or aid efficient pharmaceutical release. 13Non-toxic, non-allergenic and inert gold and platinum can be used as electrode materials; however toxins and allergens should be avoided in fabrication. Economic plating techniques that rely on bath components and construction materials that are toxic or allergenic introduce health risks and are therefore difficult to implement in fabrication. One approach for deposition of biocompatible gold patterns on poly(dimethylsiloxane) has been described using chemical plating and electrochemical etching. 14 In medicine, tiopronin (TPN) has been used therapeutically as a treatment of cystine disulfide related ailments like cystinuria and prophylaxis of renal cystine calculi, functioning based on an increase in solubility. 15,16 Tiopronin capped gold nanoclusters/nanoparticles (TPN-AuNP) have also been a center of attention in a broad spectrum...

show abstract

“…This method can also be applied to other precious metals, for example, Au, Ag, and Pd. [ 60–62 ] By using the VUV/(O)‐fabricated TiO 2 micropatterns, surface‐processing techniques for pattern formation of metals on polymer substrates can be simply achieved, which raise interesting possibilities for the new design and creation of flexible electronic and optoelectronic devices.…”

Section: Resultsmentioning

confidence: 99%

Fabrication of TiO₂ Micropatterns on Flexible Substrates by Vacuum‐Ultraviolet Photochemical Treatments

Soliman

et al. 2020

Adv Materials Inter

View full text Add to dashboard Cite

solar cells, [7] photocatalysis, [8] sensors, [9,10] etc. Approaches for TiO 2 thin films including sputtering, [11] sol-gel, [12] and chemical vapor deposition [13] could be used to fabricate TiO 2 patterns on inorganic substrates with the help of photoresist. These methods were conducted in severe reaction conditions, for example, high temperature, and they were usually not applicable to polymer substrates. For flexible devices fabrication, new patterning methods, which can be processed in milder conditions and are adaptable to flexible polymer substrates, are increasingly required. [14] For example, liquid phase deposition (LPD) was proposed as a useful approach for preparing TiO 2 thin films and micropatterns in mild conditions. In this method, the reaction occurred in a liquid solution at room temperature. A soluble titanium precursor was hydrolyzed to form titanium complex ions and condensed to form TiO 2 precipitation. [15,16] Polymer substrates or silicon substrates covered with self-assembled monolayer (SAM) were patterned by UV photolithography to generate affinity patterns; thus, the TiO 2 precipitation on less-affinity regions could be selectively removed to form patterns. Based on this method, TiO 2 micropatterns were successfully fabricated on polymer substrates [17] as well as silicon substrates. [18] However, this method suffered from poor precision because the lift-off process could not precisely remove the TiO 2 on the less-affinity regions.Photolithographic patterning techniques, which can also be conducted in mild conditions, provide new possibilities for the formation of TiO 2 patterns. Vacuum ultraviolet (VUV, 172 nm, Xe 2 excimer lamp) light is strongly absorbed by O 2 , which forms active oxygen species such as ozone and atomic oxygen. [19][20][21][22][23][24][25] VUV light and the active oxygen species (VUV/ (O)) could directly dissociate titanium alkoxide precursors to form amorphous TiO 2 thin films. [19,20] However, such titanium alkoxide precursors are not suitable for operation under an ambient atmosphere because they react with water molecules and the resulting hydrolyzed products are insoluble in common solvents. For micropatterning, choosing a precursor with stable ligands is a key issue related to whether the precursor gels can be clearly removed from the undesired regions.Titanium dioxide (TiO 2 ) micropatterns have received great attention for application in photocatalysis, electronics, and optoelectronics. Formation of such micropatterns on polymer substrates is of importance in flexible device fabrication. Vacuum ultraviolet (VUV) oxidative treatment applied on metalorganic precursor gel films serves as a strategy to fabricate metal oxide films on heat-sensitive substrates such as polymers. Here, 172 nm VUV oxidative treatment through a photomask is used to directly convert the titanium metalorganic precursor films into TiO 2 patterns without further heat annealing. In comparison to the commonly used alkoxide-based precursors, titanium acetylacetonate proves to be an appropri...

show abstract

Selective Plating on Photopatterned Titanium Oxide Films

Cited by 18 publications

References 22 publications

Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer

Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer

Direct Gold Plating Selectively on UV Modified Polymer Film Using Tiopronin-Gold

Fabrication of TiO₂ Micropatterns on Flexible Substrates by Vacuum‐Ultraviolet Photochemical Treatments

Contact Info

Product

Resources

About

Selective Plating on Photopatterned Titanium Oxide Films

Cited by 18 publications

References 22 publications

Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer

Copper Plating on Glass Using a Solution Processed Copper-Titanium Oxide Catalytic Adhesion Layer

Direct Gold Plating Selectively on UV Modified Polymer Film Using Tiopronin-Gold

Fabrication of TiO2 Micropatterns on Flexible Substrates by Vacuum‐Ultraviolet Photochemical Treatments

Contact Info

Product

Resources

About

Fabrication of TiO₂ Micropatterns on Flexible Substrates by Vacuum‐Ultraviolet Photochemical Treatments