2012
DOI: 10.1109/led.2012.2191760
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Selenium Segregation for Effective Schottky Barrier Height Reduction in NiGe/n–Ge Contacts

Abstract: In this letter, we report the demonstration of an effective electron Schottky barrier height (Φ n B ) reduction technology for NiGe/n-type Germanium (n-Ge) contacts using ion implantation of selenium (Se) followed by its segregation at NiGe/n-Ge interface. Se was found to segregate at NiGe/n-Ge interface after germanide formation. Nickel monogermanide was formed using a 350 • C 30-s anneal. Se segregation gives Φ n B as low as ∼0.13 eV.

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Cited by 38 publications
(15 citation statements)
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“…144,307,[378][379][380][381][382][383][384][385][386][387][388][389][390] However, the net effect of interfacial chalcogen varied, as both significant increases 307 and decreases 386 in the n-type SBH were observed. To introduce impurities such as metals, [391][392][393][394][395] dopants, 348,389,390,[396][397][398][399][400][401][402][403][404] semiconducting, 405,406 and insulating 407 elements to the MS interface, various other methods have also been used, including deposition, ion implantation, segregation, etc. As shown in Fig.…”
Section: B Sbh Modification With Thin Layer Of Insulating Materialsmentioning
confidence: 99%
“…144,307,[378][379][380][381][382][383][384][385][386][387][388][389][390] However, the net effect of interfacial chalcogen varied, as both significant increases 307 and decreases 386 in the n-type SBH were observed. To introduce impurities such as metals, [391][392][393][394][395] dopants, 348,389,390,[396][397][398][399][400][401][402][403][404] semiconducting, 405,406 and insulating 407 elements to the MS interface, various other methods have also been used, including deposition, ion implantation, segregation, etc. As shown in Fig.…”
Section: B Sbh Modification With Thin Layer Of Insulating Materialsmentioning
confidence: 99%
“…Consequently, the donor-type trap levels due to Sb segregation at the Ni silicide/n-Si interface generate positive charges on the Si side of the interface. These positive charges then induce negative charges of equal magnitude (interfacial dipoles) on the Ni silicide side of the interface, generating an electric field [13,14,16,17]. This electric field leads to the sharp band bending of Si, which reduces the electron barrier width.…”
Section: Resultsmentioning
confidence: 99%
“…This mechanism may also be possible for Ge and other chalcogens (i.e., Se and Te) if the solid solubility limit of chalcogens in Ge is larger near the NiGe/Ge interface than in bulk Ge. If chalcogens are present in Ge around the interface, the currents through the chalcogen donor levels may be dominant, which act as assist levels for electrons, 7,9,10 for example, by trap-assisted tunneling (TAT) 20 or the Poole-Frenkel effect (field-assisted thermal ionization). 21 These models, together with our previously reported model for S-NiGe/Ge, 7 suggest the following mechanism for SBH modification in chalcogen-NiGe/Ge.…”
Section: à3mentioning
confidence: 99%
“…9,10 However, no reports have investigated whether the chalcogen Te has an effect similar to that of S and Se on the SBH. Thus, more data are needed for comparing the effects of these chalcogens on the electrical characteristics of NiGe/Ge junctions.…”
mentioning
confidence: 99%