“…CZ silicon Sb-doped Si (1 0 0) wafers of 0.01 X cm resistivity were used. Process previously designed and described in [7,10], did not consider the negative influence of swirl-defects in the guiding properties. Fabrication process includes the following basic operations: chemical cleaning in RCA solutions, silicon nitride deposition, photolithography, plasma chemical etching of silicon nitride, two-step anodization, silicon nitride removal, chemical cleaning, and thermal oxidation of PS.…”