Self-contained in-vacuum in situ thin film stress measurement tool

Abstract

A fully self-contained in-vacuum device for measuring thin film stress in situ is presented. The stress was measured by measuring the curvature of a cantilever on which the thin film was deposited. For this, a dual beam laser deflectometer was used. All optics and electronics needed to perform the measurement are placed inside a vacuum-compatible vessel with the form factor of the substrate holders of the deposition system used. The stand-alone nature of the setup allows the vessel to be moved inside a deposition system independently of optical or electronic feedthroughs while measuring continuously. A Mo/Si multilayer structure was analyzed to evaluate the performance of the setup. A radius of curvature resolution of 270 km was achieved. This allows small details of the stress development to be resolved, such as the interlayer formation between the layers and the amorphous-to-crystalline transition of the molybdenum which occurs at around 2 nm. The setup communicates with an external computer via a Wi-Fi connection. This wireless connection allows remote control over the acquisition and the live feedback of the measured stress. In principle, the vessel can act as a general metrology platform and add measurement capabilities to deposition setups with no modification to the deposition system.

Tool Condition Monitoring for High-Performance Machining Systems—A Review

“…The common wireless technologies, utilized to transmit data to the host computer in TCM systems, include Wi-Fi [ 78 , 79 , 106 , 113 , 114 , 115 , 116 ], Bluetooth [ 82 , 95 , 117 , 118 ], and ZigBee [ 91 , 93 , 119 , 120 ]. Table 2 provides the specifications of the available wireless communication protocols used in the TCM systems [ 121 , 122 ].…”