Due to their increasingly complex 3D geometries, upcoming gate all around (GAA) devices pose new metrology challenges for which there is not yet any established HVM metrology solution, in particular for various critical timed etch steps [5]. Soft x-ray (SXR) scatterometry using 10-20 nm wavelength light is a promising next-generation metrology technique for 3D profile metrology and overlay (OVL) applications. This wavelength regime offers unique benefits over existing metrology techniques today: (1) Short wavelengths allow for higher resolution measurements than traditional visible wavelengths could offer, enabling measurement of structures at device pitches. (2) Primarily single scattering yields low correlation between parameters and aids physical interpretation of signals. This enables many parameters of interest to be extracted accurately and simultaneously. (3) SXR provides 3D capability, with stack heights up to 400 nm supported and high depth resolution due to the broadband source and sensor. These properties together make SXR suitable for measuring the 3D profiles of advanced devices such as gate all around (GAA) transistors, as well as after develop (ADI) overlay at device pitch. In this paper, we demonstrate SXR for profile metrology of GAA devices. We show sensitivity to average SiGe lateral recess etch depth as well as individual nanosheet critical dimensions, which cannot be reliably accessed by other nondestructive, inline metrology techniques available today. We furthermore demonstrate sensitivity in ADI OVL measurements directly on device-pitch structures in the presence of an underlying patterned nuisance layer.

A Mo/Si multilayer film may blister under hydrogen exposure. In this paper, we investigate the impact of intrinsic stress on blister formation in multilayers by varying the Si thickness between 3.4-11 nm and changing the hydrogen ion exposure conditions. Increasing the thickness of a-Si is found to introduce a higher average compressive stress in the multilayer film. Measurements of the average film stress before and after hydrogen exposure did not reveal a correlation between stress relaxation and the observation of surface blisters. Comparing the experimentally observed blister size distribution to that predicted by elastic models of blistering due to pressure, and thin film buckling showed that increasing hydrogen pressure under the blister cap is the main cause of the observed blisters. It is also shown that hydrogen diffusion plays an essential role in the blister formation process as sufficient hydrogen is required to pressurize the blister.

Abstract:We experimentally investigate spectral control of high-harmonic generation in a wide-diameter (508 μm) capillary that allows using significantly lower gas pressures coupled with elevated drive laser energies to achieve higher harmonic energies. Using phase shaping to change the linear chirp of the drive laser pulses, we observe wavelength tuning of the high-harmonic output to both larger and smaller values. Comparing tuning via the gas pressure with the amount of blue shift in the transmitted drive laser spectrum, we conclude that both adiabatic and non-adiabatic effects cause pulse-shaping induced tuning of high harmonics. We obtain a fractional wavelength tuning, Δλ/λ, in the range from −0.007 to + 0.01, which is comparable to what is achieved with standard capillaries of smaller diameter and higher pressures. 752-755 (1996). 32. G. Tempea and T. Brabec, "Nonlinear source for the generation of high-energy few-cycle optical pulses," Opt.Lett. 23(16), 1286-1288 (1998).

The growth development of nanometer thick Mo and Si layers was studied using in situ laser deflection and Low Energy Ion Scattering (LEIS). The growth stress obtained from changes in wafer curvature during growth is correlated to changes in the surface stochiometry monitored by LEIS. For Si on Mo, the compressive-tensile-compressive stress development could be explained by the formation of interfacial silicide compounds and the transition between these and the bulk growth of Si. For Mo on Si, a strong initial tensile stress due to silicide formation saturates upon reduced availability of free Si at the growing Mo surface, followed by a near instantaneous tensile increase in stress related to the amorphous-to-crystalline phase transition, which coincides with the end of the compound formation, as determined with LEIS.

A fully self-contained in-vacuum device for measuring thin film stress in situ is presented. The stress was measured by measuring the curvature of a cantilever on which the thin film was deposited. For this, a dual beam laser deflectometer was used. All optics and electronics needed to perform the measurement are placed inside a vacuum-compatible vessel with the form factor of the substrate holders of the deposition system used. The stand-alone nature of the setup allows the vessel to be moved inside a deposition system independently of optical or electronic feedthroughs while measuring continuously. A Mo/Si multilayer structure was analyzed to evaluate the performance of the setup. A radius of curvature resolution of 270 km was achieved. This allows small details of the stress development to be resolved, such as the interlayer formation between the layers and the amorphous-to-crystalline transition of the molybdenum which occurs at around 2 nm. The setup communicates with an external computer via a Wi-Fi connection. This wireless connection allows remote control over the acquisition and the live feedback of the measured stress. In principle, the vessel can act as a general metrology platform and add measurement capabilities to deposition setups with no modification to the deposition system.