Self-diffusion in platinum

Cattaneo, Fabiano; Germagnoli, E.; Grasso, Francesco

doi:10.1080/14786436208213170

Cited by 67 publications

(16 citation statements)

References 7 publications

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“…To measure the self-diffusion coefficients of fcc Pt by mechanical sectioning from 1598 to 1873 K, Kidson and Ross [36] applied a mixture of 193 Pt, 195m Pt, and 197 Pt obtained by neutron activation of pure Pt on polycrystalline fcc Pt. Cattaneo et al [37] employed 195 Pt to determine the self-diffusion coefficients of fcc Pt by surface decrease method from 1523 to 1998 K, where polycrystalline Pt was used. With the sputter sectioning method, the diffusivities of 197 Pt in fcc Pt single crystals were measured by Rein et al [38] from 850 to 1265 K. The impurity diffusion coefficients of Pt in polycrystalline Cu were measured by Fogelson et al [39] with X-ray diffraction analysis from 1023 to 1348 K. Neumann et al [40] measured the impurity diffusion coefficients of 191 Pt and 195 Pt in single crystal Cu by the microtome sectioning method from 1149 to 1352 K.…”

Section: The Cu-pt Systemmentioning

confidence: 99%

Diffusion Mobilities in fcc Cu-Au and fcc Cu-Pt Alloys

Liu

Zhang

2009

J. Phase Equilib. Diffus.

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Abundant diffusion data in binary fcc Cu-Au and fcc Cu-Pt alloys have been assessed to obtain the atomic diffusion mobilities of fcc Cu-Au and fcc Cu-Pt alloys by the CALPHAD method. The obtained mobilities are expressed as functions of compositions and temperatures. Good agreements are obtained from comprehensive comparisons between the calculated and experimentally measured self-diffusion coefficients, impurity diffusion coefficients, tracer diffusion coefficients, interdiffusion coefficients, and concentration curves. Accordingly, the developed mobility parameters, in conjunction with the CALPHAD-type thermodynamic descriptions, can be used to simulate diffusion behaviors at high temperatures. It is believed that the results of this work contribute to the design of a general Cu mobility database.

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Section: The Cu-pt Systemmentioning

confidence: 99%

Diffusion Mobilities in fcc Cu-Au and fcc Cu-Pt Alloys

Liu

Zhang

2009

J. Phase Equilib. Diffus.

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“…Hence the temperature instabilities of sub-micron unit cell structures can be similarly addressed for metals that in those respects show a similar behaviour to Ni, 37 such as Co, 43 or for metals, that require higher growth temperatures but have lower self-diffusivities, such as Pt. [44][45][46] For metals, such as Cu, that require higher temperatures for graphene growth and have high self-diffusivities (3 orders of magnitude higher for Cu than Ni at 900 °C), 47,48 successfully applying our approach may be more challenging. Nonetheless there are further avenues to increase template stability for instance by plasma precoating.…”

Section: Fig 3 (A) Raman Spectra Of: Graphene On a 500 Nm Thick Ni mentioning

confidence: 99%

Chemical vapour deposition of freestanding sub-60 nm graphene gyroids

Cebo

Aria

Dolan

et al. 2017

Applied Physics Letters

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The direct chemical vapour deposition (CVD) of freestanding graphene gyroids with controlled sub-60 nm unit cell sizes is demonstrated. Three-dimensional (3D) nickel templates were fabricated through electrodeposition into a selectively voided triblock terpolymer. The high temperature instability of sub-micron unit cell structures was effectively addressed through the early introduction of carbon precursor, which stabilizes the metallized gyroidal templates. The as-grown graphene gyroids are self-supporting and can be transferred onto a variety of substrates. Furthermore they represent the smallest free standing graphene 3D structures yet produced with a pore size of tens of nm, as analysed by electron microscopy and optical spectroscopy. We discuss the generality of our methodology for the synthesis of other types of nanoscale, 3D graphene assemblies and the transferability of this approach to other 2D materials.

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“…The activation energies depend strongly on the fabrication process of the studied test samples. The value for the pure-Pt samples is, with 1.22 eV, low compared to the self-diffusion activation energy in bulk platinum of 2.89 eV [13], suggesting that the electromigration-based damaging takes place in the grain boundaries and at the surface of the layer. The titanium or tantalum adhesion layers, which lead to Ti or Ta oxide formation in the platinum grain boundaries, increase the activation energy of the samples and improve their stability as already observed for aluminium addition to copper conductive lines [14].…”

Section: Reliability Of Platinum Thin Filmsmentioning

confidence: 96%